WMSIC Electronic Components

HCI(杭晶) XC32M4-25.000-F22NLDTL

ModelXC32M4-25.000-F22NLDTL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC32M4-25.000-F22NLDTL
Type
HCI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC32M4-25.000-F22NLDTL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.16g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0263576887
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
22pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC32M4-25.000-F22NLDTL 产品概述

一、产品简介

XC32M4-25.000-F22NLDTL 为杭晶(HCI)全国产化贴片晶振,封装形式为 SMD 3225(4P)金属外壳。该器件标称频率 25.000 MHz,面向对频率精度与温度稳定性有较高要求的嵌入式时钟源、微控制器振荡回路及通信类系统,已由型号 0132M4-25.000F22DTNLL 升级更名为 XC32M4-25.000-F22NLDTL。

二、主要参数

  • 晶振类型:贴片晶振(SMD)
  • 封装:3225-4P(金属)
  • 频率:25.000 MHz
  • 常温频差(初始容差):±10 ppm
  • 频率稳定度(含温度变化):±20 ppm(工作温度范围内)
  • 负载电容:22 pF
  • 等效串联电阻(ESR):50 Ω
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 品牌:HCI(杭晶)
  • 型号:XC32M4-25.000-F22NLDTL(国产化)

三、产品特点

  • 高频率精度高:常温初始频差仅 ±10 ppm,适合对时钟精度有严格要求的系统。
  • 宽温度范围稳定:在 -40 ℃~+85 ℃ 下整体频率稳定度可控制在 ±20 ppm,适合工业级环境。
  • 低等效串联电阻:ESR 50 Ω,保证在常见晶体管及 MCU 驱动电平下易于起振。
  • SMD 3225 小体积封装:适合高密度贴片组装与自动化生产,金属外壳利于屏蔽与机械可靠性。
  • 全国产化供应链:有利于稳定供货与成本管控,便于国产化替换与认证对接。

四、典型应用

  • 单片机/微控制器主时钟源(MCU、DSP)
  • 串口/以太网/通信设备时钟参考
  • 精密测量与计时模块
  • 工业控制、仪器仪表、汽车电子(非极端温度场合)
  • 各类消费电子需外部晶振的时序电路

五、封装与安装建议

  • 引脚形式为 4P SMD,建议按标准 3225 焊盘布局进行 PCB 设计以保证良好焊接强度与回流兼容性。
  • 负载电容建议使用两只匹配 22 pF 电容,分别从晶体两端到地,注意考虑 PCB 板上寄生电容对实际 CL 的影响,可在调试阶段微调电容值以获得最佳起振与频率精度。
  • 可兼容常规无铅回流焊工艺,请按器件制造商或行业建议执行回流曲线与焊接工艺,以避免过热影响机械与频率特性。

六、品质与可靠性

杭晶(HCI)提供国产化生产与质量控制,器件经过出厂筛选与电参数测试,适合量产应用。对于关键应用建议与供应方确认样片测试结果、加速应力测试及长期稳定性要求,以满足项目认证及可靠性验证。

七、选型与订购建议

在选型时,请与系统设计的起振电路、负载电容及所用驱动器件(如 MCU 内部放大器)共同验证起振裕度。订购时请注明完整型号 XC32M4-25.000-F22NLDTL、所需数量与焊盘形式,如需样品可与杭晶授权销售或代理联系获取技术支持与器件测试报告。

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