WMSIC Electronic Components

HCI(杭晶) XC32M4-24.000-F16NLDT

ModelXC32M4-24.000-F16NLDT
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC32M4-24.000-F16NLDT
Type
HCI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC32M4-24.000-F16NLDT
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.041g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0264340498
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
16pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC32M4-24.000-F16NLDT 产品概述

一、产品简介

XC32M4-24.000-F16NLDT 为杭晶(HCI)推出的全国产化贴片金属谐振器,封装为 SMD3225-4P。器件标准频率 24.000 MHz,常温频差 ±10 ppm,频率稳定度 ±20 ppm(含温度、老化等综合影响),等效串联电阻(ESR)典型值 50 Ω,适用于工业级温度范围 -40℃ 至 +85℃。该器件设计用于高可靠性时钟源与频率参考场合,兼顾小尺寸与优良电性能。

二、主要性能参数

  • 频率:24.000 MHz
  • 常温频差:±10 ppm(25℃)
  • 频率稳定度:±20 ppm(典型,含温度与长期漂移)
  • 负载电容:16 pF
  • 等效串联电阻(ESR):50 Ω(典型)
  • 工作温度:-40℃ ~ +85℃
  • 封装:SMD 3225, 4P(金属贴片结构)
  • 品牌:HCI(杭晶),全国产化生产线

三、产品特点

  • 全国产化,供应链可控,适合国产化替代项目;
  • 金属贴片外壳,抗机械冲击与湿热性能优良;
  • 小型 3225 封装,有利于高密度贴装与轻量化设计;
  • 低 ESR 有利于稳定振荡启动与较大负载能力;
  • 宽温工作范围,满足多数工业与消费类应用需求。

四、典型应用

  • 单片机与微控制器时钟源(MCU、DSP);
  • 通信设备与协议芯片参考时钟;
  • 工业控制与测试仪器;
  • 消费类电子的定时与同步电路;
  • 需要国产化零件的系统级解决方案。

五、使用建议与注意事项

  • 负载电容匹配:器件标称 CL=16 pF。按对称电容计算,建议在振荡器两端并联电容选择约 27 pF(取决于PCB寄生电容,典型寄生 2–5 pF,可据实际板上测量调整);
  • 布局建议:晶振尽量靠近振荡器输入端(MCU/芯片 XTAL 引脚)放置,走线短且左右对称,避免强电磁干扰源及大电流走线平行;
  • 焊接与回流:遵循无铅回流温度曲线与元件厂商的焊接规范,避免过热或长时间高温;
  • 贮存与防潮:按常规器件防潮要求保存,开封后按回流前干燥处理规范操作。

六、订购信息与支持

型号:XC32M4-24.000-F16NLDT;封装:SMD3225-4P;品牌:HCI(杭晶)。如需样片、技术文件(频率-温度曲线、老化曲线、典型等效电路图、推荐焊盘尺寸)或大批量供货方案,请联系供应商或杭晶技术支持以获取详细资料与一致性测试报告。

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