WMSIC Electronic Components

HCI FR08S4-32.768-N06LLDT FR08S4

ModelFR08S4-32.768-N06LLDT
PackageMC-306
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI FR08S4-32.768-N06LLDT
Type
HCI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
FR08S4-32.768-N06LLDT
Electronic Component
1
Package
MC-306
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.248g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264340515
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
6pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FR08S4-32.768-N06LLDT 32.768kHz贴片晶振产品概述

一、产品基本定位

FR08S4-32.768-N06LLDT是杭晶电子(HCI)推出的工业级32.768kHz贴片石英晶振,针对需要精准时钟基准、低功耗运行及宽温适应性的电子设备设计。作为RTC(实时时钟)、定时电路的核心元件,该晶振兼顾精度、可靠性与成本效益,广泛适配消费电子、工业控制、物联网终端等多领域应用。

二、核心技术参数详解

该晶振参数围绕32.768kHz标准频率优化,关键特性如下:

  1. 频率特性:标称频率32.768kHz(RTC领域通用标准,便于与主流计时芯片匹配);常温(25℃)频差±20ppm,即实际输出频率偏差≤0.655Hz,满足日常计时精度需求;
  2. 频率稳定度:±20ppm(覆盖温度、时间漂移,长期工作下频率波动可控);
  3. 负载电容:6pF(振荡电路外接电容匹配值,常见方案为两端各接3pF电容,简化外围设计);
  4. 等效串联电阻(ESR):50kΩ(32.768kHz晶振典型范围,保证振荡易启动、功耗低);
  5. 工作温度:-40℃~+85℃(工业级宽温,适应户外、车载、工业现场等极端场景)。

三、封装与物理特性

采用MC-306小型贴片封装,属于2引脚无引线设计:

  • 尺寸紧凑(约3.2×1.5mm),节省PCB空间,适配高密度贴装;
  • 贴片式支持自动化SMT生产,提高效率、降低人工成本;
  • 封装结构抗振动/冲击,减少机械应力对频率的影响。

四、核心优势与适用场景

4.1 核心优势

  • 精准计时适配:32.768kHz天然匹配RTC芯片,频差+稳定度满足99%以上计时需求(年误差≤1分钟);
  • 低功耗运行:低频+合理ESR,配合CMOS反相器振荡电路,静态电流低至μA级,适合电池供电设备;
  • 宽温可靠性:-40℃~+85℃覆盖工业/户外场景,无需额外温度补偿;
  • 易匹配设计:6pF负载电容为行业常见值,外围仅需2个匹配电容,降低设计复杂度;
  • 品牌可靠性:杭晶电子(HCI)产品经多轮老化测试,长期可靠性有保障。

4.2 典型应用

  • 消费电子:智能手机、智能手表、机顶盒、路由器的RTC模块;
  • 工业控制:PLC、传感器节点、工业仪表的定时/同步电路;
  • 物联网终端:低功耗IoT设备(智能门锁、环境传感器)的定时唤醒;
  • 车载电子:车载导航、仪表盘、行车记录仪的时钟基准;
  • 医疗设备:小型医疗仪器的计时功能(低功耗、宽温需求)。

五、可靠性与环境适应性

除工作温度外,该晶振还具备:

  • 振动耐受:符合IEC 60068-2-6,承受10~2000Hz振动(加速度10g);
  • 冲击耐受:符合IEC 60068-2-27,承受100g(11ms)冲击;
  • 湿度适应:0~95%RH(无凝露)环境长期工作无异常;
  • 长期可靠性:老化后频率变化≤5ppm,寿命可达10年以上。

六、选型与应用注意事项

  1. 匹配电容:选NPO材质(温度系数小),两端各接3pF(并联后总负载≈6pF);
  2. PCB布局:晶振与匹配电容尽量靠近,减少布线长度,避免干扰;
  3. 电源要求:振荡电路电源纹波≤50mV,避免电压波动影响频率;
  4. 焊接工艺:回流焊温度≤260℃(时间≤10s),避免手工焊接损伤封装。

该晶振以稳定的性能、紧凑的封装和宽温适应性,成为多领域时钟基准的优选元件,可直接替换同类32.768kHz贴片晶振,无需大幅调整电路设计。

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