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HCI(杭晶) 0132M4-8.192F20DTNJL
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 0132M4-8.192F20DTNJL
- Type
- HCI
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 0132M4-8.192F20DTNJL
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.049g
- Frequency
- 8.192MHz
- Electronic Component
- 1
- Electronic Component
- BM0264526951
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0132M4-8.192F20DTNJL 产品概述
一、产品概览
0132M4-8.192F20DTNJL 为杭晶（HCI）全国产化贴片晶振，封装为 SMD3225-4P（3.2 × 2.5 mm 金属贴片封装）。器件工作频率 8.192 MHz，设计用于对频率精度和稳定性有较高要求的时钟源场合，如实时时钟（RTC）、MCU系统时钟、通信与物联网终端等。该型号在常温下的频差为 ±10 ppm，满足精密同步与计时应用的基本要求。
二、主要特性
- 贴片金属封装，SMD3225-4P，体积小、机械强度高
- 额定频率：8.192 MHz（基频）
- 常温频差（25°C）：±10 ppm
- 频率稳定度（含温漂与老化等）：典型 ±30 ppm（详见具体测试条件）
- 负载电容：20 pF
- 等效串联电阻（ESR）：200 Ω（典型值）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 全国产化、品牌：HCI（杭晶）
三、典型应用
- 实时时钟（RTC）与计时模块
- MCU/MCU外部时钟源和定时参考
- 低功耗物联网设备与穿戴终端
- 通信模块与数据采集设备的时钟同步
- 工业控制与仪器仪表对频率稳定性有要求的场合
四、关键参数与注意点
- 频率与精度：常温±10 ppm 为器件出厂校准基准；系统设计时应考虑温漂与老化导致的总体稳定度（建议按 ±30 ppm 评估）
- 负载匹配：建议电路两端各并联与地的负载电容接近 20 pF，以保证谐振频率准确性
- ESR 与驱动：ESR 约 200 Ω，适用于常见低驱动电平晶振驱动器；设计驱动电平时应参考主控芯片或晶振厂的驱动能力规范，避免过驱动导致老化加快或振荡异常
- 环境适应：-40~+85℃ 工作温度覆盖工业级应用，封装耐焊接、抗振性能良好
五、封装与安装建议
- 封装形式：SMD3225-4P 金属贴片，建议采用标准 SMT 回流焊工艺装配
- 焊盘设计：遵循厂商推荐焊盘尺寸与焊膏印刷规范，保证焊点可靠性与热传导均匀
- 布局注意：晶振与敏感模拟电路、噪声源保持适当距离；晶振走线尽量短且使用地平面隔离，减少寄生电容与干扰
六、可靠性与质量保证
杭晶（HCI）提供全程国产化生产与质量控制，常规出厂检验包含频率、ESR、负载匹配及外观检验。为确保长期稳定性，建议按应用场景进行温度循环与老化评估，关键项目可与供应方确认加严测试项目与批次一致性保证。
七、选型建议与注意事项
- 若系统对温漂有更高要求，可向供应商询问更严格频率稳定度等级或温补（TCXO）方案
- 在高精度计时场合，需同时考虑系统时钟方案中的振荡器驱动电路、PCB 布局与旁路电容匹配，以发挥晶振的额定性能
- 订购时确认批次与规格表（Datasheet），并在样机阶段完成实际工作环境下的频率验证
本产品适合需要国产化供应链、工业级温度范围及中高精度频率要求的工程应用。如需详细 Datasheet、PCB 焊盘建议或样品评估支持，请联系供应商获取进一步技术资料。
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