WMSIC Electronic Components

HCI XC32M4-16.000-F12LLHP XC32M4

ModelXC32M4-16.000-F12LLHP
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC32M4-16.000-F12LLHP
Type
SMD3225-4P
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC32M4-16.000-F12LLHP
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.044g
Frequency
16MHz
Electronic Component
1
Electronic Component
BM0264527013
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC32M4-16.000-F12LLHP 产品概述

一、产品简介

XC32M4-16.000-F12LLHP 是杭晶(HCI)推出的全国产化贴片金属晶振,基准频率 16.000 MHz。该器件采用 SMD3225-4P 小型封装,面向单片机、通信模组、工业控制及消费电子等需稳定时钟源的应用场景,兼顾尺寸、可靠性与成本优势。

二、主要性能与规格

  • 晶振类型:贴片金属(SMD)
  • 频率:16.000 MHz
  • 常温频差:±20 ppm
  • 频率稳定度(含环境波动):±20 ppm
  • 负载电容:12 pF(标称)
  • 等效串联电阻(ESR):60 Ω(典型/最大)
  • 工作温度范围:-20 ℃ ~ +70 ℃
  • 封装:SMD3225-4P(贴片、四脚结构)
    上述参数适合对频率精度要求中等、工作环境为常温或一般工业级温度范围的电子产品。

三、结构与封装说明

SMD3225-4P 为 3.2 × 2.5 mm 小型贴片封装,四脚结构提供更好的机械支撑与焊点可靠性。金属外壳有助于抑制外界电磁干扰(EMI),提高频率稳定性与抗振性能,适合表面贴装工艺(SMT)批量生产。

四、应用场景

  • 单片机(MCU)与微处理器的主/辅助时钟来源
  • 无线通信模块、蓝牙/LoRa 等射频子系统参考时钟
  • 工业控制、仪器仪表中的时序/通信模块
  • 消费类电子、智能家居产品的定时与同步电路

五、使用与焊接建议

  • 负载电容:器件标称负载电容为 12 pF,推荐在晶振两端各并联至地的两只电容,元件值应综合 PCB 板上寄生电容(通常 2–5 pF)计算以达到有效负载 12 pF。
  • 布线:将晶振与 MCU 振荡引脚之间布线尽量短且成对对称,避免过多直流耦合元件和走线跨越噪声源,建议在晶振周围保留接地回流区以降低干扰。
  • 回流焊:建议遵循厂家回流焊温度曲线与 J-STD-020 等业界规范,避免长时间高温暴露以保证器件长期可靠性。
  • 静电与存储:操作时注意防静电保护,包装及存放应避免潮湿与强振动环境。

六、订购与注意事项

XC32M4-16.000-F12LLHP 为杭晶(HCI)系列国产化产品,适合量产替换与本地化供应链。订购时请确认所需频差、温度等级与封装尺寸,并与供应商确认实际出货的频率与测试报告。若应用对温漂、相位噪声或高/低温性能有更高要求,建议咨询厂方选型更高等级器件或提供样品测试验证。

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