WMSIC Electronic Components

X1E0000210129

ModelX1E0000210129
PackageSMD3225-4P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON X1E0000210129
Type
EPSON
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
X1E0000210129
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.048g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0265794240
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EPSON X1E0000210129无源贴片晶振产品概述

一、产品核心身份与定位

X1E0000210129是爱普生(EPSON)推出的无源贴片晶振,属于高精度时钟基准器件,主要面向需要稳定24MHz时钟信号的电子设备。作为无源元件,它无需内置振荡电路,需配合外部振荡电路(如MCU内置振荡器+匹配电容)即可实现时钟输出,兼具成本优势与设计灵活性,是工业级、消费级设备的常用时钟源选择。

二、关键电气参数详解

该型号的核心电气参数直接决定其应用适配性,具体如下:

  1. 频率特性:标称频率24MHz,是电子设备中通用的时钟基准(可作为CPU、通信模块的倍频/分频基础);常温(25℃)频差控制在±10ppm内,即频率偏差不超过240Hz(24MHz×10×10⁻⁶),满足多数设备对时钟精度的需求。
  2. 负载电容:12pF,无源晶振的负载电容是振荡电路匹配的关键(需在电路中并联/串联电容以满足此值),12pF为行业通用规格,适配多数MCU与ASIC的内置振荡器设计。
  3. 等效串联电阻(ESR):40Ω,ESR直接影响晶振起振能力与稳定性——40Ω处于无源晶振的合理范围(通常20-100Ω),既保证易起振,又避免因ESR过高导致的振荡幅度衰减或不稳定。

三、封装与物理特性

采用SMD3225-4P封装,即表面贴装式3.2×2.5mm(长×宽)4引脚封装,符合小型化电子设备的设计趋势。引脚布局为对称式4引脚,适配标准SMT贴装设备,可实现高速自动化生产,降低人工成本。封装材质采用陶瓷,具备良好的抗机械应力与环境稳定性,避免温度变化导致的封装形变影响频率精度。

四、环境适应性表现

工作温度范围覆盖**-40℃~+85℃**,属于宽温级规格,可满足户外设备、工业控制、车载电子等严苛环境下的稳定运行。在全温范围内,频差仍能保持合理波动(行业常规宽温晶振温漂通常≤±20ppm),此型号常温±10ppm的基础上,温漂表现优异,确保时钟信号长期稳定。

五、典型应用场景

X1E0000210129因参数适配性强,广泛应用于以下领域:

  1. 工业控制:PLC(可编程逻辑控制器)、伺服驱动器的时钟基准,满足宽温与抗干扰需求;
  2. 通信设备:路由器、交换机、无线AP的时钟模块,24MHz可作为主时钟或参考时钟,适配以太网协议;
  3. 消费电子:机顶盒、智能电视、智能穿戴设备的MCU时钟源,小型化封装适合便携设备;
  4. 车载电子:车载导航、仪表盘的时钟电路,宽温范围适配车辆-40℃~85℃的工作环境;
  5. 医疗设备:小型医疗仪器(如血糖仪、监护仪)的时钟基准,保证数据采集与处理的时间同步。

六、产品优势总结

  1. 品牌可靠性:爱普生作为晶振行业龙头,具备成熟生产工艺与质量管控,产品一致性与长期稳定性有保障;
  2. 设计灵活性:无源晶振无需内置振荡电路,可配合不同MCU/ASIC的振荡模块,降低电路设计复杂度;
  3. 宽温适配:-40℃~+85℃的工作温度覆盖多数严苛场景,减少环境因素对时钟精度的影响;
  4. 小型化优势:SMD3225封装体积小,适合当前电子设备的轻薄化、小型化趋势;
  5. 通用参数:24MHz频率、12pF负载电容为行业通用规格,适配多数现有电路设计,无需额外调整匹配参数。

该型号凭借稳定的性能与广泛的适配性,成为众多电子设备时钟设计的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.