Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI FR07S4-32.768-NTLLLDT FR07S4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI FR07S4-32.768-NTLLLDT
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- FR07S4-32.768-NTLLLDT
- Electronic Component
- 1
- Package
- MC-146
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.072g
- Frequency
- 32.768kHz
- Electronic Component
- 1
- Electronic Component
- BM0264820046
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±20ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12.5pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FR07S4-32.768-NTLLLDT 产品概述
一、产品简介
FR07S4-32.768-NTLLLDT 为杭晶（HCI）推出的国产化贴片表晶振，标准频率 32.768 kHz，专为低功耗时钟/实时时钟（RTC）电路设计。器件采用贴片封装，尺寸小、性能稳定，适用于消费电子、物联网终端、智慧表计和可穿戴设备等需高精度低频时钟源的场合。型号已升级为 3607S-32.768DTTLLLL，向下兼容原始功能与封装要求。
二、主要参数
- 晶振类型：贴片表晶（表面贴装）
- 标称频率：32.768 kHz
- 常温频差：±20 ppm
- 频率稳定度（工作区间）：±20 ppm
- 额定负载电容：12.5 pF
- 等效串联电阻（ESR）：50 kΩ（典型）
- 工作温度范围：-40 ℃ ～ +85 ℃
- 品牌：HCI（杭晶）
三、封装与型号信息
- 外观/封装：7015 尺寸（标注 4P），制造与测试包装代号 MC-146。
- 型号升级：原型号升级为 3607S-32.768DTTLLLL，升级后保持电气与封装兼容，便于在既有产品中无缝替换或作为后续料号管理使用。
四、典型应用
- 单片机/微控制器内置 RTC 振荡输入（手机、物联网节点、传感器网关）
- 电表、智能抄表与计量设备的时间基准
- 可穿戴设备与手表的低功耗时钟
- 需要长时间低功耗运行的计时与唤醒系统
五、选型与电路兼容性建议
- 负载电容：晶体标称 CL=12.5 pF，建议在晶体两端各并联对称电容。考虑 PCB 引线与输入引脚的寄生电容（约 2–5 pF），通常每侧采用 22 pF 的贴片电容可达到设计目标（按 CL=(C1*C2)/(C1+C2)+Cstray 进行修正）。
- ESR 考量：ESR≈50 kΩ，为典型调谐叉晶体阻抗值。选择 MCU/振荡器输入时需确认其能支持该 ESR（多数 MCU 的低频 RTC 驱动兼容此类晶体）。
- 相容性：升级型号保持脚位与电气特性一致，但在替换时仍建议比对封装尺寸与焊盘图以确保机械兼容。
六、安装与使用注意事项
- PCB 布局：晶体附近应保证对称走线与短引线，振荡器两端接地处需良好接地，避免邻近高频电路与大电流回路干扰。
- 焊接工艺：遵循晶体厂家的回流温度曲线与焊接说明，避免超出最大应力温度并尽量减少重复回流次数。
- 存储与搬运：避免强力弯曲与机械冲击，避免潮湿环境长期暴露，必要时按厂方建议进行烘干处理再回流。
七、质量与供应
本产品为全国产化方案，杭晶（HCI）提供稳定量产与本地化技术支持，适合需要供应链可控与长期供货保障的项目。建议在设计阶段索取完整数据手册与可靠性测试报告以便于通过设计验证与生产准入。
如需样品、封装尺寸图或详细数据手册，可联系厂商技术支持获取更详尽的应用资料与测试建议。
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