WMSIC Electronic Components

HCI XC32M4-25.000-F09NLCT XC32M4

ModelXC32M4-25.000-F09NLCT
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC32M4-25.000-F09NLCT
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC32M4-25.000-F09NLCT
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.1g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0264526973
Operating Temperature
45℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
9pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC32M4-25.000-F09NLCT 产品概述

一、产品简介

XC32M4-25.000-F09NLCT 是杭晶(HCI)推出的全国产化贴片金属晶振,标准工作频率 25.000 MHz,封装为 SMD3225-4P(3225,4引脚)。器件采用金属外壳结构,具有体积小、抗振动和散热性能良好的特点,适合空间受限且对频率精度有要求的高速时钟源场合。

二、主要参数

  • 频率:25.000 MHz
  • 常温频差(25℃):±10 ppm
  • 频率稳定度(综合):±20 ppm
  • 负载电容:9 pF(建议外接负载电容按设计计算)
  • 等效串联电阻(ESR):50 Ω
  • 工作温度范围:-45 ℃ ~ +85 ℃
  • 封装:SMD3225-4P(贴片金属封装)
  • 制造及来源:全国产化,品牌 HCI(杭晶)

三、典型应用

  • 微控制器(MCU)与数字信号处理器(DSP)系统时钟
  • 高速通信与网络设备本振/参考时钟
  • 工业控制、仪器仪表与车载电子(需核对车规要求)
  • 消费类电子及医疗设备等对频率精度有中高要求的应用

四、焊接及电路使用建议

  • 推荐将晶振靠近 MCU 时钟脚布局,缩短引线长度以降低寄生电容与干扰。
  • 外接负载电容应按照目标负载电容 CL=9 pF 及电路板寄生电容计算,常用公式 C1=C2≈2×(CL−Cstray)。典型电路为两端各并接一只至地的高频陶瓷电容。
  • 焊接工艺遵循回流温度曲线,注意避免超温及长时间重流;金属封装需合理预热以减少热应力。

五、可靠性与品质控制

杭晶出厂经过筛选测试以保证常温频差和 ESR 等关键参数,器件设计满足工业级温度范围(-45 ℃ ~ +85 ℃),适用于要求长期稳定性的系统。建议在量产前进行样机验证(振幅、相位噪声及老化测试)以符合系统整体指标。

若需样品、详细规格书(包括相位噪声、老化曲线及回流条件)或封装尺寸图,请提供联络方式或直接联系杭晶(HCI)技术支持获取完整资料。

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