Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI 8132S-40.000NQ33FTL 8132S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 8132S-40.000NQ33FTL
- Type
- HCI
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 8132S-40.000NQ33FTL
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Temperature-Compensated Crystal Oscillator (TCXO)
- Electronic Component
- 0.063g
- Frequency
- 40MHz
- Electronic Component
- 1
- Electronic Component
- BM0264527030
- Operating Temperature
- 30℃~+85℃
- Operating Voltage
- 3.3V
- Output
- Electronic Component
- Frequency
- ±500ppb
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
8132S-40.000NQ33FTL 产品概述
一、产品简介
8132S-40.000NQ33FTL 为杭晶（HCI）出品的一款高精度温补晶体振荡器（TCXO），基准频率 40.000 MHz，工作电压 3.3V，输出波形为削峰正弦波（Clipped sine）。器件采用 SMD 3225-4P 封装，工作温度范围 -30℃～+85℃，面向需要高频率稳定性与抗干扰能力的工业级与通信级应用。
二、主要参数（一览）
- 频率：40.000 MHz
- 初始频率精度：±1 ppm
- 温度域频率稳定度：±0.5 ppm（±500 ppb，-30℃～+85℃）
- 输出模式：削峰正弦波（Clipped sine）
- 工作电压：3.3 V
- 工作温度：-30℃ ～ +85℃
- 封装：SMD 3225-4P（尺寸 3.2 × 2.5 mm，4 引脚）
- 品牌：HCI（杭晶）
三、性能亮点
- 高频率稳定性：在工业温度范围内可实现 ±0.5 ppm 的频率稳定度，适合对相位噪声与频偏有严格要求的系统。
- 高初始精度：出厂校准初始精度达到 ±1 ppm，缩短系统调试与校准时间。
- 紧凑封装：3225 小尺寸 SMD 封装，利于高密度 PCB 布局与自动化贴装生产。
- 低噪声、可靠输出：削峰正弦波输出在驱动模拟/混合前端时具有良好的抗失真特性，便于后端处理电路使用。
四、典型应用场景
- 通信设备与基带时钟（基站、收发模块）
- 精密测试与测量仪器（频率计、示波器前端）
- 工业控制与自动化（PLC、运动控制）
- 定位与导航相关设备（需高稳定时钟参考的模块）
- 嵌入式系统与网络设备（路由器、网关等）
五、封装、安装与注意事项
- 封装型号：SMD3225-4P，推荐采用符合行业标准的 3225 焊盘布局与无铅回流工艺。
- 焊接建议：遵循厂家提供的回流温度曲线进行焊接，避免超过推荐峰值温度以保证长期可靠性。
- 静电与存储：器件对静电敏感，建议采取 ESD 防护措施；长期储存请置于干燥、防潮环境。
- 布局建议：将 TCXO 远离大电流开关电源和高频辐射源，且供电侧加适当去耦电容以降低电源噪声对频率的影响。
六、选型与订购建议
在系统设计初期确认以下要点：工作温区、初始精度是否满足系统容差、输出形式（削峰正弦）是否与后端输入兼容、以及封装尺寸是否适配 PCB。订购时请参考型号全称 8132S-40.000NQ33FTL 并注明工作温度范围与电压要求，必要时向厂商索取详细数据手册（包含相位噪声、谐波、输出幅度与回流曲线）以完成最终验证。
如需对接样品或获取完整规格书与应用参考，请联系杭晶（HCI）授权代理或技术支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
