WMSIC Electronic Components

HCI 8132H-10.000NL33DTL 8132H

Model8132H-10.000NL33DTL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 8132H-10.000NL33DTL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
8132H-10.000NL33DTL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.058g
Frequency
10MHz
Electronic Component
1
Electronic Component
BM0264340538
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Output
CMOS
Frequency
±2ppm
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

8132H-10.000NL33DTL 产品概述

一、产品简介

8132H-10.000NL33DTL(品牌:HCI/杭晶)为高精度温补晶振(TCXO),标准频率10.000MHz,输出模式为CMOS。该器件以小型SMD3225-4P封装提供,在-40℃至+85℃工业级温度范围内保持优异的频率稳定性与抗环境能力。型号已升级为8132H-Y10.000NL33DTL,向下兼容原有封装与电气特性,适合要求高稳定性与高初始精度的时钟源应用。

二、主要性能参数

  • 频率:10.000 MHz
  • 初始精度:±1 ppm(出厂校准)
  • 温度下频率稳定度:±2 ppm(工作温度范围内)
  • 输出模式:CMOS(推挽输出)
  • 工作电压:3.3 V
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD 3225,4 引脚(3225-4P)
  • 品牌:HCI(杭晶)

三、产品特点

  • 高精度:出厂初始精度达±1 ppm,适合对基准频率精度要求高的系统。
  • 高稳定性:TCXO内部温度补偿电路有效控制温漂,保证全温区±2 ppm 级别稳定度。
  • 低电压驱动:3.3 V 供电,兼容主流 MCU、FPGA 和收发芯片的时钟输入。
  • 小巧封装:3225 SMD 封装便于表面贴装和体积受限的系统集成。
  • 宽温适应:工业温度等级,适用于户外、通信及工业控制等苛刻环境。

四、典型应用场景

  • 通信设备:基站、业务网关、同步网元的本振或参考时钟。
  • 测试测量:频谱仪、计时仪器与同步测试平台。
  • 导航与定位:作为参考时钟提升接收机稳定性与锁相性能。
  • 工业控制与物联网终端:需要长期稳定时钟源的嵌入式设备。

五、使用建议与注意事项

  • 电源旁路:在晶振 VCC 与 GND 之间靠近器件焊盘放置 0.1 μF 陶瓷旁路电容,减小电源噪声对频率的影响。
  • 布局:保持地平面连续,信号线尽量短且避免穿越敏感模拟电路区域;CMOS 输出直接驱动时注意上升/下降沿对系统 EMI 的影响。
  • 焊接:遵循推荐回流曲线进行焊接,避免过高峰温或过长加热时间以保护内部补偿电路。
  • 测试:在最终应用环境下对温漂与老化进行验证,必要时通过系统级校准进一步提高整体精度。

如需器件引脚定义、推荐贴片尺寸或完整数据手册,可以提供更详细的技术资料或样品支持。

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