Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI XC32M4-32.000-F12NLDT XC32M4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI XC32M4-32.000-F12NLDT
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- XC32M4-32.000-F12NLDT
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.039g
- Frequency
- 32MHz
- Electronic Component
- 1
- Electronic Component
- BM0264982097
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC32M4-32.000-F12NLDT 产品概述
一、产品简介
XC32M4-32.000-F12NLDT 是杭晶（HCI）推出的全国产化贴片晶振，采用金属封装的 SMD3225-4P 封装，专为对频率精度和稳定性有较高要求的电子系统设计。器件工作频率为 32.000 MHz，具有良好的温度适应性和可焊性，适配批量生产与国产供应链替代需求。
二、主要性能参数
- 品牌：HCI（杭晶）
- 型号：XC32M4-32.000-F12NLDT
- 晶振类型：贴片晶振（SMD）
- 标称频率：32.000 MHz
- 常温频差：±10 ppm（常温参考点）
- 频率稳定度：±20 ppm（工作温度范围内整体稳定度）
- 负载电容：12 pF
- 等效串联电阻（ESR）：40 Ω（典型值）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：SMD 3225（3.2 mm × 2.5 mm），4 引脚金属结构
三、产品特点
- 全国产化设计与生产，供应链可控性强。
- 金属贴片封装，机械强度高，热稳定性好，适合回流焊工艺。
- 低 ESR，有利于启动性能和振荡稳定性。
- 适用工业级温度范围，可靠性和长期漂移性能优良。
四、典型应用
- 微控制器和单片机时钟源（MCU/MPU）。
- 通信设备与数字基带处理器时钟。
- 精密计时、采样与数据转换电路的时钟基准。
- 消费电子、工业控制、仪表仪器与嵌入式系统等需要 32MHz 时钟的场景。
五、焊接与安装建议
- 器件兼容标准无铅回流焊工艺，建议按器件规格书或 IPC/JEDEC 回流曲线进行。
- 安装时注意避免过度应力，焊接后冷却应均匀，防止封装翘曲。
- 建议在潮湿敏感等级（MSL）管理下储存与使用，必要时在回流前进行烘烤除湿。
六、订购与注意事项
- 订购时请确认型号、频率、负载电容与频差等级，避免混型。
- 如需更严格的频率稳定度或扩展温度等级，可与厂方技术支持沟通定制方案。
- 建议在设计阶段验证 PCB 阻抗与寄生电容对负载电容的影响，确保振荡电路匹配良好。
XC32M4-32.000-F12NLDT 为面向工业与商用产品的高可靠性 32MHz 贴片晶振，结合国产化供应链与金属贴片封装特性，是替代进口晶振、满足量产与长期供货的稳妥选择。如需更详细的电气参数曲线、回流焊曲线或封装尺寸图纸，请提供联系信息以获得完整规格书与应用参考资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
