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HCI XC32M4-12.000-F20NJDT XC32M4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI XC32M4-12.000-F20NJDT
- Type
- HCI
- Minimum package
- 3000 卷盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- XC32M4-12.000-F20NJDT
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.042g
- Frequency
- 12MHz
- Electronic Component
- 1
- Electronic Component
- BM0264527032
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC32M4-12.000-F20NJDT 产品概述
一、产品简介
XC32M4-12.000-F20NJDT 为杭晶（HCI）出品的全国产化贴片晶振，封装为 SMD3225-4P（金属顶盖），标称频率 12.000 MHz。器件针对 MCU 与数字系统时钟源设计，尺寸紧凑、加工兼容性好，可直接回流焊装贴，适合批量 SMT 生产。
二、主要技术参数
- 频率：12.000 MHz
- 常温频差：±10 ppm
- 频率稳定度（含温度与老化）：典型 ±20 ppm（部分升级/替代型号可达 ±30 ppm）
- 负载电容：20 pF
- 等效串联电阻（ESR）：100 Ω
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：3225（3.2 × 2.5 mm）SMD3225-4P，金属封装
- 品牌：HCI（杭晶）
- 型号关联：升级/替代型号 0132M4-12.000F20DTNJL
三、产品优势
- 全国产化供应链，便于批量供货与质量追溯；
- 金属顶盖封装，抗干扰性能与机械可靠性良好；
- 标准 3225 SMD 封装，兼容主流 SMT 工艺与自动化贴装；
- 常温频差优异，适合对时钟精度有较高要求的应用。
四、典型应用场景
- 微控制器（MCU）系统主时钟、数字逻辑定时；
- 网络与通信设备、时序要求的外设；
- 工业控制、嵌入式设备与仪器仪表；
- 消费电子类中对温度范围与稳定性有要求的产品。
五、选型与注意事项
- 选型时确认系统所需负载电容为 20 pF；若电路板寄生电容较大，应调整匹配电容以确保频率精度；
- 回流焊工艺需遵循厂商推荐温度曲线，避免过高峰温影响晶体性能与寿命；
- 若对长周期老化或更宽温度稳定度有更高要求，可咨询 HCI 关于升级型号 0132M4-12.000F20DTNJL 的详细规范与兼容性说明。
如需样品、完整规格书（包括波特率、老化测试、焊接曲线与机械尺寸图）或大批量报价，请提供需求数量与应用环境，我们可协助核对最终参数与可替代型号。
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