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HCI 3131M-32768DT06LLL 3131M
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 3131M-32768DT06LLL
- Type
- HCI
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 3131M-32768DT06LLL
- Electronic Component
- 1
- Package
- SMD3215-2P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.049g
- Frequency
- 32.768kHz
- Electronic Component
- 1
- Electronic Component
- BM0264340531
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±20ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 6pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
3131M-32.768DT06LLL 产品概述
一、产品简介
3131M-32.768DT06LLL 为杭晶（HCI）全国产化贴片表晶，封装为 SMD3215-2P（俗称 3215 封装）。器件频率为 32.768 kHz，专为低功耗实时时钟与计时器电路设计，完成型号升级替代早期产品，适用于大批量国产化替换需求。
二、主要技术参数
- 晶振类型：贴片晶振（表面贴装）
- 频率：32.768 kHz
- 常温频差：±20 ppm
- 频率稳定度（含温度影响）：±20 ppm
- 负载电容：6 pF
- 等效串联电阻（ESR）：约 70 kΩ
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装规格：SMD3215-2P（尺寸 3.2 mm × 1.5 mm）
- 品牌：HCI（杭晶）
三、核心特点与优势
- 低频低功耗：32.768 kHz 标准频率，配合 6 pF 负载，适配低功耗 CMOS/CMOS-like 振荡器输入，利于延长电池寿命。
- 高频率稳定性：常温及工作温区内总体频率稳定度控制在 ±20 ppm，满足多数消费类与工业级 RTC 精度要求。
- 封装小型化：3215 封装便于 SMT 自动化生产，节省 PCB 面积。
- 全国产化来源：供应链稳定，适合国产替换与长期供货。
四、典型应用场景
- 实时时钟（RTC）模块与单芯片微控制器的外部晶振（如手表、计时器、低功耗数据采集设备）。
- 物联网终端、无线传感器节点、可穿戴设备等对低功耗、高可靠性时间基准要求的场合。
- 工业控制与嵌入式系统中需要长期稳定计时的电路。
五、封装与可靠性
SMD3215-2P 小型贴片封装，兼容 SMT 回流焊工艺（建议参考厂商回流曲线与焊接指导），通过常温与温度循环测试，适配 -40 ℃ 至 +85 ℃ 工况。建议在设计时预留合适焊盘与机械保护以降低应力影响。
六、选型与使用注意事项
- 匹配负载电容：确保电路中并联电容与 PCB 寄生电容合计接近 6 pF，以获得标称频率。
- 振荡器驱动与 ESR 兼容：参考所用 MCU/RTC 的晶体参数与推荐电路，ESR 约 70 kΩ，适用于高阻抗输入的低功耗振荡器。
- 安装与处理：避免在回流和波峰焊过程中超过厂商推荐温度曲线，防止机械冲击与强酸碱清洗剂直接作用；存储时防潮防静电。
七、订购信息
型号：3131M-32.768DT06LLL
品牌：HCI（杭晶）
封装：SMD3215-2P
如需样品、批量报价或技术资料（封装图、焊接建议、频率-温度曲线），请联系供应商或杭晶代理渠道获取详细支持。
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