WMSIC Electronic Components

HCI XC21M4-24.000-F08NLDT XC21M4

ModelXC21M4-24.000-F08NLDT
PackageSMD2016-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC21M4-24.000-F08NLDT
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC21M4-24.000-F08NLDT
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.03g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0264982129
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
8pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC21M4-24.000-F08NLDT 贴片石英晶振产品概述

一、产品定位与品牌背景

XC21M4-24.000-F08NLDT是杭晶电子(HCI)推出的工业级高频贴片石英晶振,属于杭晶XC21M系列的核心型号之一。杭晶作为国内晶振行业的主流厂商,拥有20余年石英晶体研发生产经验,产品覆盖消费电子、工业控制、通信等领域,以“宽温稳定、高可靠性”为核心优势,广泛应用于国内外客户的终端产品中。该型号针对小型化设备的宽温时钟需求设计,是替代传统直插晶振的高性价比选择。

二、核心电气性能参数

该晶振围绕24MHz高频时钟的稳定输出优化,关键参数适配多数数字电路需求:

  • 频率精度:常温频差±10ppm(24MHz下波动≤±240Hz),满足UART、SPI等数据传输的精度要求;
  • 负载电容:8pF(型号“F08”标识),为MCU、FPGA等芯片的常用匹配值,无需额外复杂调试;
  • 全温稳定度:±20ppm(覆盖-40℃~+85℃),全温范围内频率变化≤±480Hz,可稳定支持户外/工业现场场景;
  • 等效串联电阻(ESR):100Ω,属于同封装同频率晶振的中等偏优水平,低ESR降低振荡功耗,避免停振风险;
  • 工作温度:-40℃~+85℃,符合工业级标准,适应低温(北方户外)、高温(车间控制柜)环境。

三、封装与机械特性

采用SMD2016-4P封装(2.0mm×1.6mm×0.6mm),是小型化设备的主流选择:

  • 体积优势:相比3225封装缩小约40%,可有效压缩PCB面积,适配智能穿戴、物联网节点等小型产品;
  • 焊接兼容性:4引脚贴片结构符合回流焊工艺,支持自动贴片机批量生产,引脚间距均匀无短路风险;
  • 环保合规:无铅封装,满足RoHS、REACH指令,可用于出口产品。

四、典型应用场景

结合性能与封装,该晶振适用于以下场景:

  1. 工业控制:PLC模块、传感器节点、电机控制器,宽温范围适应车间温度变化;
  2. 物联网终端:WiFi/BLE模块、智能电表、环境传感器,小封装支持设备小型化;
  3. 消费电子:智能手表、智能家居控制器、便携式医疗设备,精度满足数据采集需求;
  4. 通信辅助:小型无线AP、蓝牙网关,稳定时钟保证数据传输同步性。

五、可靠性与长期稳定性

杭晶对该型号进行严格可靠性测试,确保实际应用可靠性:

  • 抗振抗冲击:符合IEC 60068-2-6(振动)、IEC 60068-2-27(冲击)标准,承受运输/现场轻微冲击;
  • 老化特性:年老化率≤±5ppm(1年后频率变化≤±120Hz),长期使用仍稳定;
  • 湿度适应:0~95%RH(非凝结),适配南方潮湿环境。

六、应用注意事项

为保证稳定工作,需注意:

  1. 负载电容匹配:总负载电容(PCB寄生+外接)需为8pF(如寄生2pF则外接6pF),避免频率偏移;
  2. 焊接工艺:回流焊峰值温度230~245℃(时间≤10s),禁止手工焊接高温损伤;
  3. 布局设计:晶振靠近MCU时钟引脚(走线≤10mm),避免与高频线平行减少干扰;
  4. 静电防护:晶振为静电敏感元件,生产/存储需防静电包装与手环。

该型号以“高性价比+宽温稳定”为核心,是工业、物联网等领域小型化设备的理想时钟解决方案。

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