WMSIC Electronic Components

HCI 0132M4-8.192F10DTNL 0132M4

Model0132M4-8.192F10DTNL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0132M4-8.192F10DTNL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0132M4-8.192F10DTNL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.5g
Frequency
8.192MHz
Electronic Component
1
Electronic Component
BM0264982147
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
10pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0132M4-8.192F10DTNL 产品概述

一、产品简介

0132M4-8.192F10DTNL 是杭晶(HCI)推出的全国产化贴片石英晶体件,封装为 SMD 3225-4P(金属贴片型),基准频率 8.192 MHz。器件面向追求稳定时钟源的小型化电子设备,采用金属封装和 SMD 贴片工艺,适合表面贴装回流焊工艺,可靠性高,批量供应稳定,适合工业级与消费级混合应用。

二、主要性能参数

  • 频率:8.192 MHz
  • 常温频差(初始容差):±10 ppm
  • 频率稳定度(温度范围内):±20 ppm
  • 负载电容:10 pF
  • 等效串联电阻(ESR):≤ 200 Ω
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD3225-4P(金属,3225 尺寸 3.2 mm × 2.5 mm,4 引脚)
  • 品牌:HCI(杭晶),全国产化生产

三、产品特性

  • 小型化封装(3225)满足高密度 PCB 布局要求;4P 引脚设计便于可靠焊接与良好接地。
  • 金属封装提高抗机械冲击与温度稳定性,适合恶劣环境下长时间工作。
  • 初始频差与温度稳定度控制严格,适用于对时间基准有较高要求的系统。
  • ESR 控制在 200 Ω 以内,兼容主流微控制器与振荡器驱动电路。

四、典型应用场景

  • MCU、DSP、FPGA 的系统时钟或外部振荡源。
  • 实时时钟(RTC)、计时与定时电路。
  • 通信设备与无线模块的频率参考。
  • 工业控制、仪器仪表、物联网终端与消费电子产品。

五、设计与使用建议

  • 推荐在振荡器电路中采用两只对称连接的耦合电容(C1、C2)与晶体配合使用,使实际的负载电容接近标称 10 pF。负载电容计算公式:CL = (C1*C2)/(C1 + C2) + Cstray,其中 Cstray 为电路板与封装带来的寄生电容(一般 1–3 pF)。设计时应考虑寄生电容带来的影响并通过实际振荡频率调整电容值。
  • 芯片与晶体之间走线应尽量短且对称,避免将敏感信号走线通过晶体附近;为减少噪声耦合建议将晶体地引脚短接到最近的接地平面。
  • 建议遵循器件的回流焊可焊温度限值和实际工艺曲线(与供应商确认),避免超温或长时间高温暴露以保护内部晶体结构与焊接可靠性。
  • 储存与搬运注意防潮、防撞击,避免重压与机械应力。

六、订购与质量保障

本产品由杭晶(HCI)国内生产,具备稳定供货链与质量检验流程。标准出货会提供批次测试报告与外观检验,量产前可依据客户需求提供样品及相关技术支持。

结语:0132M4-8.192F10DTNL 以其小尺寸、金属封装与良好频率稳定性,适合对体积与可靠性有要求的时间基准与振荡应用。欲获取样品、规格书或布局建议,请联系杭晶技术支持。

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