WMSIC Electronic Components

HCI XC32M4-20.000-F18NJDT XC32M4

ModelXC32M4-20.000-F18NJDT
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI XC32M4-20.000-F18NJDT
Type
HCI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
XC32M4-20.000-F18NJDT
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.041g
Frequency
20MHz
Electronic Component
1
Electronic Component
BM0264527034
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
18pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC32M4-20.000-F18NJDT 产品概述

一、产品简介

XC32M4-20.000-F18NJDT 为全国产化贴片金属封装晶振,品牌 HCI(杭晶),封装形式为 SMD3225-4P(3.2 × 2.5 mm,四脚)。器件提供 20.000 MHz 基本频率,面向对频率精度与稳定性有较高要求的工业级与消费类电子产品,兼顾小体积与可靠性的设计,适合 SMT 贴装工艺。

二、主要参数

  • 频率:20.000 MHz
  • 常温频差(Initial):±10 ppm(25℃)
  • 频率稳定度(含温度等因素):±20 ppm
  • 负载电容:18 pF
  • 等效串联电阻(ESR):50 Ω(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD3225-4P,金属外壳,全国产化

三、产品特点与优势

  • 国产化供应,交期与本地化支持更有保障;
  • 金属封装抗干扰与散热性能优于陶瓷型,稳定性更好;
  • 小型 3225 贴片封装,便于高密度 PCB 设计与自动化装配;
  • 低 ESR 有利于起振快速且输出幅度稳定;
  • 宽工作温度覆盖工业级应用,适用性广。

四、典型应用

  • 单片机/微控制器系统时钟源;
  • 通信设备、射频前端参考时钟;
  • 精密测量仪器与测试设备;
  • 消费类电子、车载电子(需符合应用温度与振动要求时请确认);

五、注意事项与使用建议

  • 负载电容匹配:为达到标称频率与稳定度,请遵循晶振所标 18 pF 负载值,常见做法是对称使用两只外接耦合电容,考虑 PCB 与引线寄生电容后选择电容值(经验上单侧约 30–36 pF,依据实际测量与寄生电容调整);
  • 布局:晶振附近保持走线短且远离大电流开关信号与高频耦合源,接地平面完整以降低干扰;
  • 贴装与回流:采用标准 SMT 回流工艺,遵循厂方推荐的回流温度曲线以避免元件应力与性能漂移;
  • 存储与老化:长期存储应避免高温高湿环境,上电前建议依据产品规范进行老化验证以确认频率稳定性。

XC32M4-20.000-F18NJDT 以其国产化背景、稳健的电气特性与小型金属封装,适合需要可靠时钟参考的各类电子系统。欲获取完整电气特性曲线、回流曲线与封装尺寸图,请联系 HCI(杭晶)或查阅产品数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.