Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI XC32M4-25.000-F18LJDT XC32M4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI XC32M4-25.000-F18LJDT
- Type
- HCI
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- XC32M4-25.000-F18LJDT
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.04g
- Frequency
- 25MHz
- Electronic Component
- 1
- Electronic Component
- BM0264340502
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±20ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 18pF
- Frequency
- ±30ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC32M4-25.000-F18LJDT 产品概述
一、产品简介
XC32M4-25.000-F18LJDT 为全国产化贴片金属封装晶振，品牌：HCI（杭晶）。器件频率为 25.000 MHz，封装尺寸 SMD3225-4P（3.2 × 2.5 mm，4 引脚），外形紧凑、机械强度高，适配主流贴片加工与自动化装配工艺。器件针对工业级温度范围设计，具有良好的频率稳定性与可靠性，适用于多种精确时钟源需求。
二、主要电气参数
- 标称频率：25.000 MHz
- 常温频差：±20 ppm（25℃ 标准条件）
- 频率稳定度（全温域参考）：±30 ppm
- 负载电容：18 pF（建议每端接 18 pF 对地，参考被驱动器件说明）
- 等效串联电阻（ESR）：50 Ω（典型）
- 工作温度：-40 ℃ ~ +85 ℃
三、结构与特性
金属外壳提供良好电磁屏蔽和温度传导性能，3225-4P 结构利于焊接可靠性与机械支撑。等效串联电阻在 50 Ω 范围内，适合驱动常见的 MCU/PLL/FPGA 等集成振荡电路；18 pF 的设计便于与内部负载电容要求相匹配，减少外部补偿工作量。
四、使用建议与布局注意事项
- 根据被驱动器件（MCU/PLL）文档选择是否使用外接负载电容；若使用外部电容，建议两端各接 18 pF 至地，并尽量使用与晶振封装引脚靠近的接地点。
- 布局时将晶振放置在被驱动器件的振荡引脚附近，缩短焊盘到引脚的走线，避免与高频信号线并行走线或通过噪声源下方。
- 为了保证稳定性和抗干扰，推荐在晶振附近布置连续的接地平面，并避免在晶振附近放置大电流回流路径或开关电源元件。
五、典型应用场景
- 嵌入式微控制器系统时钟源（MCU/MPU）
- 通信设备与网络设备中的本振与参考时钟
- 测试测量仪器、消费类电子产品以及对温度范围有要求的工业控制设备
六、可靠性与选型提示
产品为国产化金属贴片晶振，适用于需要长期稳定时钟的系统设计。在选型阶段，请确认目标系统对频差（±20 ppm 常温）与全温稳定度（±30 ppm）的容忍度，并考虑温漂、加速度敏感度等特殊工况时向厂方索取详细规格书与样件进行评估。订购时使用完整型号 XC32M4-25.000-F18LJDT 并与供应商确认包装方式与出货测试项目。
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