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HCI 0132M4-13.1072F10DTNJL 0132M4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 0132M4-13.1072F10DTNJL
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 0132M4-13.1072F10DTNJL
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.043g
- Frequency
- 13.1072MHz
- Electronic Component
- 1
- Electronic Component
- BM0264820053
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 10pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0132M4-13.1072F10DTNJL 产品概述
一、产品简介
0132M4-13.1072F10DTNJL 为杭晶（HCI）全国产化贴片晶振，采用金属外壳、SMD 3225-4P 封装（3.2 × 2.5 mm，4 引脚结构），标称频率 13.1072 MHz。该器件针对对频率精度和温度稳定性有较高要求的消费电子、通信与工业类应用，兼顾小体积、低功耗与良好的焊接可靠性。
二、主要技术参数
- 标称频率：13.1072 MHz
- 常温频差（25℃）：±10 ppm
- 频率稳定度（-40℃ ～ +85℃）：±20 ppm
- 负载电容（CL）：10 pF
- 等效串联电阻（ESR）：80 Ω（典型）
- 工作温度范围：-40℃ ～ +85℃
- 封装：SMD3225-4P（金属封装，4 引脚）
- 品牌：HCI（杭晶）
- 国产化设计与生产，适合大批量供应与替换应用
三、特性与优势
- 小型化封装（3225）适合高密度 PCB 布局，4 引脚结构有利于机械固定与散热性能提升。
- 常温频差 ±10 ppm 与温度范围内 ±20 ppm 的稳定度，能满足多数对时基精度要求较高的系统（如通信基带、定时参考等）。
- 低至 80 Ω 的 ESR 对常见振荡电路（如 Pierce 振荡器）兼容性较好，便于电路调试与匹配。
- 全国产化供应链，有利于成本控制、交期保障与后续技术支持。
四、典型应用场景
- MCU/微处理器的时钟源与外部定时参考
- 无线通信收发模块与中频/本振参考（需根据系统相位噪声/抖动要求评估）
- 工业控制、网络设备的实时时钟与定频应用
- 物联网节点、消费类电子中对精度有中高要求的振荡方案
五、使用与搭配建议
- 负载电容选择：器件 CL=10 pF，按对称电容设计，参考外接 C1 = C2 ≈ 15–18 pF（考虑 PCB 与封装寄生电容 2–3 pF），并通过实验验证以取得最佳频率偏移。
- 驱动电平：避免过高驱动，按晶振制造商推荐的驱动条件使用，以防止频率漂移或加速老化。
- 焊接与布线：尽量缩短晶振至 MCU 振荡引脚的走线，接地平面完整以降低噪声耦合；采用厂家推荐的 PCB 焊盘尺寸与贴装工艺，保证回流焊可靠性。
- 环境应力：在极端温度或机械振动环境下，应进行可靠性试验以验证频率漂移与失效风险。
六、可靠性与包装
- 设计符合工业级工作温度（-40℃~+85℃），适用多数工业与民用环境。
- 可根据客户需求提供卷带（Tape & Reel）包装，便于 SMT 全自动贴装与大批量生产。
七、选型与支持
在选型时建议同时参考系统的相位噪声、启动时间与长期老化指标（如有），并提供样品进行电路兼容性验证。杭晶（HCI）可提供技术文档、封装尺寸图与必要的验证报告，协助客户快速完成产品开发与替换验证。
如需封装外形图、焊盘尺寸或更详细的测试曲线（频率-温度、启动特性等），可进一步联系供应商获取完整数据手册与样品支持。
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