WMSIC Electronic Components

HCI CO53D6-100.000-33KDTSNL CO53D6

ModelCO53D6-100.000-33KDTSNL
PackageSMD5032-6P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI CO53D6-100.000-33KDTSNL
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
CO53D6-100.000-33KDTSNL
Electronic Component
1
Package
SMD5032-6P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.16g
Frequency
100MHz
Electronic Component
1
Electronic Component
BM0264527019
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~3.3V
Electronic Component
±10ppm
Output
LVDS
Frequency
±15ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CO53D6-100.000-33KDTSNL 产品概述

一、产品简介

CO53D6-100.000-33KDTSNL 是杭晶(HCI)出品的一款高稳定性差分有源晶振,标称频率100.000MHz,输出方式为LVDS 差分信号。器件采用 SMD5032-6P 封装,面向对时钟完整性和相位噪声有较高要求的消费类、通信与工业类电子系统。该型号已升级替代型号为 1553D-100.000KWVDTL。

二、主要技术参数

  • 频率:100.000 MHz
  • 常温频差(@25℃):±10 ppm
  • 频率稳定度(典型):±15 ppm(覆盖电压、温度与老化等)
  • 输出模式:LVDS 差分有源输出
  • 工作电压:2.5 V ~ 3.3 V(典型 3.3 V 应用兼容)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SMD5032-6P(5032 尺寸,6 引脚)
  • 特性:低抖动、差分输出、表面贴装

三、产品特点与优势

  1. 低抖动:差分 LVDS 输出配合有源驱动结构,可提供优秀的时钟完整性,适用于高速数据链路与采样系统。
  2. 宽电压兼容:2.5 V 至 3.3 V 的工作范围,便于与多种 FPGA、SERDES 与高速逻辑接口兼容。
  3. 宽温度与高稳定性:-40~+85℃ 环境下仍然保持 ±15 ppm 的频率稳定度,适合工业级应用。
  4. 小型化封装:SMD5032-6P 提供高度集成与便于 SMT 组装的尺寸优势,节省 PCB 空间。
  5. 兼容替代型号:型号升级为 1553D-100.000KWVDTL,便于产品迭代与库存管理。

四、典型应用场景

  • 通信设备中高速串行时钟(PHY、SERDES)
  • FPGA/ASIC 系统时钟源与参考时钟
  • 高速 ADC/DAC 的采样钟(需要低相位噪声/低抖动)
  • 测试测量仪器与精密计时设备
  • 工业自动化及车载电子(在合适认证下)

五、使用建议与注意事项

  • 差分线终端:接收端建议使用 100 Ω 差分负载匹配以保证信号完整性。
  • 旁路与去耦:电源引脚附近建议放置 0.1 µF 与 1~10 µF 的去耦电容,靠近器件引脚布置以降低噪声。
  • 布线:差分走线须保持等长、恒定差分阻抗(约 100 Ω),避免跨过大面积地/电源切换层。
  • 焊接工艺:遵循无铅回流曲线及厂商推荐的焊接温度限制,防止超温损伤器件。
  • 储存与搬运:避免静电与机械应力,符合一般晶振类器件的防护要求。

六、可靠性与合规

本系列器件适用于工业温度范围,制造过程中可按客户要求提供焊接试验与电气测试批次记录。常规为无铅环保制程(RoHS)兼容;如需车规或更高等级认证,可与厂商确认型号与认证选项。

七、型号与订购信息

  • 当前型号:CO53D6-100.000-33KDTSNL(3.3V 兼容版本)
  • 升级/替代型号:1553D-100.000KWVDTL(厂方推荐替换型号)
  • 品牌:HCI(杭晶)
    订购时请注明工作电压、温度等级与频差要求,以便获取对应测试证书与包装选项。

如需样品参数曲线(相位噪声、jitter)、引脚排列图或 PCB 参考封装图,请提供联系信息或具体使用场景,我可进一步提供相关资料与设计建议。

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