WMSIC Electronic Components

HCI 3121M-32.768DT07LLL 3121M

Model3121M-32.768DT07LLL
PackageSMD2012-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 3121M-32.768DT07LLL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
3121M-32.768DT07LLL
Electronic Component
1
Package
SMD2012-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.014g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264982100
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
7pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3121M-32.768DT07LLL 产品概述

一、产品简介

3121M-32.768DT07LLL 是一款全国产化的贴片表晶振,面向低功耗实时时钟(RTC)及各类低频计时电路的应用。器件采用 SMD2012-2P(2012 封装,2 引脚)规格,标准频率为 32.768 kHz,体积小、功耗低、易于自动贴装与回流焊,便于批量化生产与国产供应链替换。型号已升级为 FC21M2-32.768-N07LLDT,兼顾性能与可供货稳定性,品牌:HCI(杭晶)。

二、主要规格参数

  • 晶振类型:贴片晶振(SMD)
  • 频率:32.768 kHz
  • 常温频差:±20 ppm
  • 频率稳定度:±20 ppm
  • 负载电容:7 pF
  • 等效串联电阻(ESR):80 kΩ
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD2012-2P(2.0 × 1.2 mm)
  • 型号升级:FC21M2-32.768-N07LLDT(向下兼容替换)

三、性能特点

  • 高频率精度与稳定性:常温频差与整体频率稳定度均为 ±20 ppm,可满足绝大多数 RTC 与低频定时器对时基精度的需求。
  • 低负载电容设计:7 pF 标称负载电容,适配常见微控制器内部振荡器或外部晶体振荡器电路,能有效降低负载电容带来的功耗与相位噪声。
  • 高 ESR 适配低频电路:80 kΩ 的等效串联电阻适合 32.768 kHz 这类低频晶体的谐振特性,有利于稳定启动与长期运行。
  • 宽温度适应性:-40 ℃ 至 +85 ℃ 的工作温度覆盖工业级温区,适合多数户外及工业类终端产品。
  • 贴片封装:2012 小尺寸封装支持高速 SMT 贴装与回流工艺,利于产品小型化与自动化生产。

四、封装与安装建议

  • 建议在 PCB 布局时将晶振靠近 MCU/振荡器引脚放置,减少引线长度与串扰。
  • 两侧走线尽量短且对称,避免通过大面积铜箔或高速信号线。
  • 外接负载电容应接至晶振引脚与地,电容值及类型(低漏电、低温漂)须与 7 pF 标称值匹配以保证振荡频率。
  • 采用标准回流工艺焊接,焊接温度曲线建议参考厂商回流规范与 IPC/JEDEC 建议,避免超温或长期高温暴露。

五、可靠性与使用注意

  • 出厂前通过常规电气与环境测试以保证频率与 ESR 等关键参数稳定性;长期老化可能引起微量漂移,设计时预留校准或误差预算。
  • 避免在未按回流规范的手工焊接过程中对器件施加过大机械应力。
  • 存储与搬运注意防潮、防静电、防机械碰撞,推荐按厂家建议的包装与出荷条件保存。

六、应用场景

适用于实时钟表(RTC)、微控制器低功耗时钟源、智能表计、物联网终端、可穿戴设备、传感器节点、家电和其他需要精准低频时基的消费与工业电子产品。

七、型号变更说明与选型建议

  • 本产品已完成型号升级,原 3121M-32.768DT07LLL 可由 FC21M2-32.768-N07LLDT 进行替代,电气参数与封装兼容性需在具体设计中确认。
  • 选型时重点考虑负载电容匹配、ESR 对振荡器启动与稳定性的影响,以及目标产品的温度与长期稳定性要求。需要批量采购或样品测试建议联系 HCI(杭晶)获取最新数据手册、器件样片及 PCB 布局参考。

如需器件详细数据手册、封装尺寸图或样片支持,可告知用途与需求,我可协助准备对接资料与选型建议。

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