WMSIC Electronic Components

HCI 0153G2-12.000F20DTLJL 0153G2

Model0153G2-12.000F20DTLJL
PackageSMD5032-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0153G2-12.000F20DTLJL
Type
HCI
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0153G2-12.000F20DTLJL
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.17g
Frequency
12MHz
Electronic Component
1
Electronic Component
BM0264526967
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0153G2-12.000F20DTLJL贴片晶振产品概述

一、产品核心定位与基础参数

0153G2-12.000F20DTLJL是杭晶电子(HCI)推出的工业级小型化贴片晶振,以12MHz为基准频率,适配多数中精度时钟需求场景。其核心参数明确,关键指标如下:

  • 基准频率:12.000MHz
  • 常温频差:±20ppm(25℃环境下频率偏差范围)
  • 负载电容:20pF(电路匹配的标准负载值)
  • 频率稳定度:±30ppm(覆盖全工作温区的频率变化范围)
  • 等效串联电阻(ESR):≤80Ω
  • 工作温度范围:-40℃~+85℃
  • 封装类型:SMD5032-2P(5.0×3.2mm贴片封装,2引脚)

二、封装与物理特性

该晶振采用SMD5032-2P标准贴片封装,尺寸为5.0mm(长)×3.2mm(宽)×1.2mm(典型厚度),属于小型化晶振范畴,适配常规SMT自动化生产线,无需特殊贴装工艺。2引脚设计简化了电路布局,同时兼容多数通用晶振座或直接贴片焊接,适合对空间敏感的设备(如小型智能终端、工业传感器)。

三、电气性能详解

其电气性能针对工业与消费电子场景做了优化,核心指标的实际价值明确:

  1. 频率精度与稳定度:常温±20ppm的频差可满足8位/16位MCU时钟、通信模块同步等中精度需求;全温区±30ppm的稳定度,确保在-40℃至+85℃范围内频率波动极小,无需额外温补组件即可稳定运行。
  2. 负载电容匹配:默认20pF负载电容,需电路设计时匹配相近值(如18-22pF),避免负载不匹配导致频率偏移,影响时钟精度。
  3. 低ESR设计:≤80Ω的等效串联电阻属于晶振常规低阻范围,可降低振荡电路的驱动功率,提升电路效率,同时减少因ESR过高导致的振荡不稳定风险。

四、环境适应性

作为工业级晶振,其环境适应性覆盖多数极端场景:

  • 宽温工作:-40℃至+85℃的工作范围,可适配户外设备(如智能路灯、环境监测站)、车载电子(如仪表盘辅助模块)、工业控制设备(如PLC传感器)等高低温环境。
  • 可靠性:符合RoHS环保标准,抗振动(≥10g)、抗冲击性能满足工业级要求,可长期在恶劣环境下稳定工作。

五、典型应用场景

基于参数与封装特性,该晶振适用于以下场景:

  1. 工业控制:PLC模块、传感器节点、工业机器人辅助电路,满足宽温与抗干扰需求;
  2. 消费电子:智能穿戴设备(手表、手环)、小型路由器、蓝牙音频模块,适配小封装与低功耗要求;
  3. 车载电子:车载通信模块(蓝牙、WiFi)、仪表盘背光控制电路,覆盖车载温区;
  4. 通信设备:小型基站、WiFi6模块、物联网网关,满足中精度时钟同步;
  5. 医疗设备:小型监护仪配件、便携式医疗仪器,符合环保与可靠性标准。

六、品牌与可靠性保障

杭晶电子(HCI)是国内晶振行业主流厂商,拥有多年研发与生产经验,产品通过ISO9001质量体系认证。0153G2-12.000F20DTLJL系列经批量可靠性测试(高低温循环、振动测试),可满足工业级产品的长期使用需求,适合批量生产应用。

该晶振以“小封装、宽温稳定、中精度适配”为核心优势,是工业与消费电子领域中高性价比的时钟解决方案。

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