WMSIC Electronic Components

HCI 1553H4-50000JWPDTSNL 1553H4

Model1553H4-50000JWPDTSNL
PackageSMD5032-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 1553H4-50000JWPDTSNL
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
1553H4-50000JWPDTSNL
Electronic Component
1
Package
SMD5032-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.126g
Frequency
50MHz
Electronic Component
1
Electronic Component
BM0264398796
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Operating Current
10mA
Electronic Component
±10ppm
Output
HCMOS
Frequency
±20ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1553H4-50000JWPDTSNL 产品概述

一、产品简介

1553H4-50000JWPDTSNL 是杭晶(HCI)推出的一款高精度 SMD 晶振模块,中心频率 50.000 MHz,封装为 SMD5032-4P。该器件输出方式为 HCMOS,工作电压范围宽(1.8V 至 3.3V),并在工业级温度范围(-40℃ 至 +85℃)内提供稳定且可靠的频率参考,适合对时钟精度与抗干扰能力有较高要求的系统。

二、主要参数

  • 频率:50.000 MHz
  • 常温频差:±10 ppm
  • 全温度频率稳定度:±20 ppm
  • 输出模式:HCMOS
  • 工作电压:1.8 V ~ 3.3 V
  • 工作电流:典型 10 mA
  • 工作温度:-40℃ ~ +85℃
  • 封装:SMD5032-4P(5032 尺寸,4 引脚)
  • 品牌:HCI(杭晶)

三、性能特点

  1. 高精度:常温频差±10 ppm,适用于对定时精度要求严格的数字通信与测量设备。
  2. 稳定性好:全温度稳定度±20 ppm,可在宽温范围内保持良好频率性能。
  3. 低电压宽适应:支持 1.8V 至 3.3V 多种电源电平,便于在不同平台上集成。
  4. HCMOS 输出:方波驱动能力强,直接驱动数字逻辑门和计时电路,兼容性高。
  5. 封装与可靠性:SMD5032 贴片封装便于自动贴装与批量生产,符合工业级可靠性要求。

四、典型应用场景

  • 工业控制与自动化系统
  • 通信设备与网络时钟源
  • 测试与测量仪器
  • 嵌入式系统与微控制器时钟
  • 航空航天与军工等对温度与可靠性有严格要求的场合

五、封装与安装建议

SMD5032-4P 采用标准贴片封装,推荐在 PCB 设计时考虑良好的地平面与去耦电容布局以降低相位噪声与电源干扰。焊接建议遵循厂家回流曲线,避免过度热应力影响长期稳定性。

六、选型与订购信息

型号:1553H4-50000JWPDTSNL,品牌:HCI(杭晶)。订购时请确认频率、公差、输出电平与工作电压兼容您的应用,若需更严格的相位噪声或老化规格,可联系厂商提供定制测试报告与批量一致性保证。

如需器件数据手册、封装尺寸图或环境测试报告,可提供更详细资料以便评估和设计集成。

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