WMSIC Electronic Components

HCI 1553H-32K768J50DTSL 1553H

Model1553H-32K768J50DTSL
PackageSMD5032-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 1553H-32K768J50DTSL
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
1553H-32K768J50DTSL
Electronic Component
1
Package
SMD5032-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.126g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264982109
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5V
Operating Current
10mA
Electronic Component
±10ppm
Output
HCMOS
Frequency
±20ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1553H-32K768J50DTSL 产品概述

一、产品简介

1553H-32K768J50DTSL 是杭晶(HCI)推出的一款高精度 32.768kHz 晶体振荡源,采用 SMD5032-4P 表贴封装。输出为 HCMOS 电平,工作电压宽泛(2.5V~5V),面向对时钟精度与稳定性有较高要求的便携与工业级应用,具有高可靠性与稳定的频率特性。

二、主要特性

  • 标称频率:32.768 kHz
  • 常温频差:±10 ppm(室温)
  • 频率稳定度:±20 ppm(全温域)
  • 输出模式:HCMOS(兼容 CMOS/TTL 逻辑)
  • 工作电压:2.5 V ~ 5.0 V
  • 工作电流:约 10 mA
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装形式:SMD5032-4P(贴片 5032,4 引脚)

三、技术规格要点

本器件在常温条件下提供 ±10 ppm 的初始频差,整机应用中配合适当的校准可实现高精度计时。±20 ppm 的频率稳定度覆盖器件在工业温度范围内的温漂表现。HCMOS 输出能直接驱动后端数字电路,适配常见微控制器与计时器输入。

四、典型应用

  • 实时时钟(RTC)与时间基准模块
  • 低功耗计量表与抄表终端
  • 工业控制与数据记录设备
  • 物联网节点、智能家居与穿戴式设备
  • 需要长时间稳定计时的嵌入式系统

五、封装与可靠性

SMD5032-4P 小尺寸封装便于贴片加工与高密度 PCB 布局,适用于回流焊工艺。杭晶在材料选用与制造过程中对可靠性做严格控制,适配宽温环境保证长期稳定性与一致性,适合工业级产品设计。

六、选型与使用建议

在系统设计中,请根据供电电压选择合适的工作点并注意去耦与地线设计,以保证 HCMOS 输出的信号完整性。若对功耗有更高要求,可结合系统唤醒/休眠策略优化平均功耗。订购时请确认封装型号(SMD5032-4P)与品牌(HCI/杭晶)以保证规格一致性。

如需样品、批量报价或更详细的温漂曲线与老化数据,可联系杭晶授权代理或技术支持获取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.