WMSIC Electronic Components

HCI 3608S-32.000-DTTLLLL 3608S

Model3608S-32.000-DTTLLLL
PackageMC-306
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 3608S-32.000-DTTLLLL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
3608S-32.000-DTTLLLL
Electronic Component
1
Package
MC-306
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.4g
Frequency
32kHz
Electronic Component
1
Electronic Component
BM0264820049
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3608S-32.000-DTTLLLL 产品概述

一、产品简介

3608S-32.000-DTTLLLL 是杭晶(HCI)推出的全国产化贴片表晶,基频 32.000 kHz,专为低功耗实时时钟(RTC)与计时应用设计。器件为贴片封装,便于自动贴装与大批量生产,适配各类微控制器与低频振荡电路。

二、主要规格参数

  • 频率:32.000 kHz(基频)
  • 常温频差:±20 ppm(25℃)
  • 频率稳定度:±20 ppm(-40℃ ~ +85℃)
  • 负载电容:12.5 pF
  • 等效串联电阻(ESR):50 kΩ
  • 工作温度范围:-40℃ ~ +85℃
  • 封装形式:SMD 表面贴装,封装尺寸 8038(厂用型号 MC-306)
  • 品牌:HCI(杭晶)

三、性能与特点

  • 高稳定性:全温区频差控制在 ±20 ppm 级别,满足精确计时与时间戳需求。
  • 低功耗、适配RTC:32 kHz 基频与较高 ESR 特性适合低驱动电平的晶体振荡器,降低系统功耗。
  • 全国产化:供应链可控,适合对国产化有要求的项目与大批量长期供应。
  • 贴片化封装:8038 尺寸兼顾机械强度与体积,支持回流焊工艺,便于自动化贴装。

四、典型应用

  • 实时时钟(RTC)、日历模块
  • 低功耗物联网终端、蓝牙/传感节点待机时钟源
  • 智能电表、医疗设备、工业控制的计时与定时功能
  • 穿戴设备、电子时钟与计时器

五、布局与使用建议

  • 两端接地电容:建议以负载电容 12.5 pF 为目标,左右两侧耦合电容对称布置。考虑 PCB 板上寄生电容,常用取值为每侧约 22~27 pF(根据实际板上寄生电容微调)以达到目标 Cload。
  • 布线要求:将晶体与 MCU/振荡器引脚间走线尽量短并屏蔽,避免与大电流或高速信号线平行耦合。
  • 接地与去耦:晶体周边地面须完整,避免地回路干扰;振荡器供电处建议加局部去耦电容。
  • 焊接工艺:支持常规回流焊,按厂方推荐的温度曲线和回流参数执行,避免过冲焊接温度。

六、封装与供货

封装尺寸 8038,厂方包装型号 MC-306,适应贴片机贴装与自动化生产。杭晶(HCI)提供稳定批次供应,适合对国产化率要求高的客户。若需大量采购或索取样品、规格书与测试数据,请联系厂方或授权分销渠道获取详细支持。

如需更详尽的电气等效模型、驱动电平或环境可靠性数据,可提供具体需求,我方协助查询厂方资料并给出匹配建议。

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