Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI FR10SH-32.768-NTLLLDTL FR10SH
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI FR10SH-32.768-NTLLLDTL
- Type
- HCI
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- FR10SH-32.768-NTLLLDTL
- Electronic Component
- 1
- Package
- MC-406
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.525g
- Frequency
- 32.768kHz
- Electronic Component
- 1
- Electronic Component
- BM0264820043
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±20ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12.5pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FR10SH-32.768-NTLLLDTL 产品概述
一、产品简介
FR10SH-32.768-NTLLLDTL 是杭晶（HCI）推出的全国产化贴片表晶，标准频率为 32.768 kHz，专为低功耗时钟、RTC（实时时钟）、便携设备及物联网终端等应用设计。器件采用贴片封装，适合表面贴装工艺，便于自动化组装与大规模生产。
二、主要性能参数
- 频率：32.768 kHz
- 常温频差：±20 ppm
- 频率稳定度（温度范围内）：±20 ppm
- 负载电容：12.5 pF
- 等效串联电阻（ESR）：50 kΩ
- 工作温度范围：-40 ℃ ～ +85 ℃
三、封装与型号说明
- 封装形式：贴片表晶，封装代号 1040（MC-406 对应封装尺寸与封装工艺兼容）
- 系列型号：FR10SH 为系列型号之一，近期型号升级/扩展参见 3610SH-32.768DTTLLLL，用户可根据尺寸与引脚需求选择对应替代型号。
四、产品特点
- 完全国产化，供应链稳定，适合本地化采购与长期供货计划；
- 低频、低功耗，适配 RTC 及低速计时电路；
- 标准负载电容 12.5 pF，便于与常见腕表/实时时钟芯片直接匹配；
- 宽温工作范围，满足工业级环境要求；
- 封装适配 SMT 自动贴装，提高生产效率与可靠性。
五、应用场景
适用于各种需精确时钟源的终端产品，如：手表与计时器、物联网节点、消费电子（遥控器、玩具）、嵌入式主板与实时计时模块、低功耗医疗设备等。
六、使用与选型建议
- 与 MCU/RTC 芯片配合时，按芯片手册推荐的负载电容值（12.5 pF）并联匹配电容，保证频率精度；
- 若应用对启动时间或振荡幅度有特别要求，请在样机验证阶段评估；
- 高湿或极端振动环境下，建议做可靠性评估或咨询厂方提供专项封装/测试资料。
如需器件封装图、频率-温度曲线或样片支持，欢迎联系杭晶（HCI）技术支持或本公司销售工程师获取详细资料与报价。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
