WMSIC Electronic Components

HCI FL26S2-32.768-N09LLDT FL26S2

ModelFL26S2-32.768-N09LLDT
PackageDT-26
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI FL26S2-32.768-N09LLDT
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
FL26S2-32.768-N09LLDT
Electronic Component
1
Package
DT-26
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.167g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264820031
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
Through-hole Crystal Oscillator
Load Capacitor
9pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FL26S2-32.768-N09LLDT 产品概述

一、产品简介

FL26S2-32.768-N09LLDT 是 HCI(杭晶)推出的全国产化直插式低频晶体振荡器,标称频率 32.768 kHz,专为实时钟表(RTC)、低功耗微控制器、计量与传感终端等对时间基准精度与长期稳定性有要求的应用设计。器件采用 DT-26(俗称“青蛙脚”)直插封装(2×6、2P),便于手工焊接与传统波峰焊安装。

二、主要技术参数

  • 型号:FL26S2-32.768-N09LLDT
  • 品牌:HCI(杭晶)
  • 频率:32.768 kHz
  • 常温频差:±20 ppm
  • 频率稳定度:±20 ppm
  • 负载电容:9 pF
  • 等效串联电阻(ESR):50 kΩ
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:DT-26(直插、青蛙脚 2*6,2P)
  • 封装形态:直插晶振(through-hole)

三、产品特点与优势

  • 全国产化:供应链本地化,交期与可追溯性优于进口替代方案。
  • 高稳定性:常温频差与频率稳定度均可达 ±20 ppm,满足大多数工业与消费类 RTC 要求。
  • 低功耗适配:32.768 kHz 为标准时钟频率,适合低频低功耗振荡器设计,配合高阻 ESR 在某些低功耗电路中有利于启动与稳定。
  • 便于装配:直插 DT-26 封装适合手工调试与传统插件生产线,机械强度好,便于维修更换。
  • 宽温度范围:-40 ℃ 到 +85 ℃,适用于工业级环境。

四、典型应用场景

  • 实时时钟(RTC)模块与系统时钟基准
  • 手持仪表、计量设备与工业控制器
  • 低功耗 MCU 的备用时钟或低速时钟源
  • 医疗设备、远程抄表(AMR/AMI)与传感器节点
  • 消费类电子的时间计量模块(带时钟的家电、玩具等)

五、电路与布局建议

  • 负载电容:标称 CL=9 pF,推荐在晶体两端各并联接地的电容值应按典型设计计算(考虑 PCB 寄生电容),通常两侧各取约 9 pF 或根据板级 Cstray 做适当修正。
  • 布线建议:将晶体及其负载电容尽量靠近振荡器输入(MCU 或专用振荡器管脚)布置,走短而直接的走线,避免穿过高频走线或大面积信号层,以降低噪声耦合。
  • 接地处理:晶体附近应有良好接地平面,避免数字信号回路穿过晶体附近产生干扰。
  • 机械应力:直插晶体对安装应力敏感,焊接时避免过热与机械拉扯,焊接后建议进行应力释放处理或留有足够的应力缓冲空间。
  • 抗干扰:在噪声较大的环境中,可在振荡器电源侧加入去耦电容,并在布局上与开关电源、大电流回路保持距离。

六、选型提示与采购信息

  • 若系统对频率精度要求更高,可选择更严格的常温频差/稳定度规格或采用温度补偿晶振(TCXO)方案;如对等效串联电阻(ESR)有特殊匹配要求,需与振荡器驱动级一并确认匹配性。
  • 型号命名提示:FL26S2-32.768-N09LLDT 意指 32.768 kHz、负载电容 9 pF、DT-26 直插封装,具体采购时请与供应商核对完整料号和批次信息以确保参数完全符合项目需求。
  • 品牌与售后:HCI(杭晶)提供本地化支持与批量供应能力,适合量产替换与长期供货需求。

若需更详细的机械尺寸图、焊接条件或电气等效电路图,请告知,我们可提供进一步的技术资料与选型对比建议。

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