WMSIC Electronic Components

HCI 049ST2-11.0592F20DTNLL 049ST2

Model049ST2-11.0592F20DTNLL
PackageHC-49S-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 049ST2-11.0592F20DTNLL
Type
HCI
Minimum package
200 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
049ST2-11.0592F20DTNLL
Electronic Component
1
Package
HC-49S-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.535g
Frequency
11.0592MHz
Electronic Component
1
Electronic Component
BM0264526968
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
Through-hole Crystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

049ST2-11.0592F20DTNLL直插晶振产品概述

一、产品基本定位与型号解析

049ST2-11.0592F20DTNLL是HCI(杭晶)品牌推出的工业级直插石英晶振,属于HC-49S封装系列,核心频率为11.0592MHz。该型号的命名逻辑清晰:

  • 049S:对应HC-49S标准直插金属封装;
  • T2:代表工业级温度范围(-40℃~+85℃);
  • 11.0592:核心谐振频率(串口通信领域经典频率);
  • F20:匹配负载电容为20pF;
  • DTNLL:包含常温频差(±10ppm)、频率稳定度(±20ppm)等关键性能标识。

产品定位为中精度、高可靠性的时钟源,适配单片机、串口通信等常规电子设备的核心计时需求。

二、核心技术参数详解

1. 频率与频差

  • 频率:11.0592MHz(串口通信黄金频率):该频率的整数分频可精确匹配9600bps、19200bps等标准波特率(如11.0592MHz÷12=921.6kHz,再分频8倍得到115200bps),避免波特率误差导致的数据传输丢包。
  • 常温频差:±10ppm(约±110.6Hz):25℃环境下频率偏差极小,满足绝大多数消费电子、工业模块的计时精度要求。

2. 负载电容与ESR

  • 负载电容:20pF:晶振工作需外接2个20pF陶瓷电容(并联至地),此参数为最佳匹配值,偏离会导致频率偏移(如电容偏差1pF,频率偏移约20ppm)。
  • 等效串联电阻(ESR):50Ω:属于HC-49S封装的低损耗水平,低ESR可加快晶振起振速度(通常<1ms),减少功耗(约1mW),提升长期工作稳定性。

3. 频率稳定度

  • 工作温度范围:-40℃~+85℃(工业级);
  • 温度稳定度:±20ppm(约±221.2Hz):在全温区范围内,频率相对于常温的最大变化量控制在±20ppm,可适应户外、车间等恶劣环境的温度波动。

三、封装与物理特性

该产品采用HC-49S直插金属封装,具备以下特点:

  • 尺寸:标准HC-49S规格(长11.5mm×宽4.5mm×高3.5mm),引脚间距2.54mm,适配常规PCB板焊盘;
  • 外壳材质:镀锡金属壳,兼具电磁屏蔽(EMI)与机械防护功能,可减少外界射频干扰对晶振的影响;
  • 引脚:2脚直插式,材质为镀锡铜,抗氧化性能好,支持手工焊接、波峰焊等工艺。

四、典型应用场景

11.0592MHz是串口通信与单片机的主流频率,该产品主要应用于:

  • 单片机系统:51系列(如AT89C51、STC89C51)、AVR单片机的外部时钟电路;
  • 串口通信模块:RS232/RS485转USB模块、工业串口服务器的波特率时钟源;
  • 小型工业设备:PLC扩展模块、传感器节点(如温湿度传感器)的计时电路;
  • 消费电子:智能门锁、遥控器、电子钟的核心计时单元。

五、品牌与质量保障

HCI(杭晶)是国内石英晶振领域的知名厂商,该产品符合:

  • 环保标准:RoHS 2.0(无铅、无镉等有害物质);
  • 质量管控:每批次产品经过100%频差测试、ESR检测,抽样做温度循环试验(-40℃~+85℃循环50次),确保稳定度达标;
  • 寿命:常温下工作寿命≥10年,工业级环境下≥5年。

该产品以高性价比、稳定可靠的特点,成为中低端电子设备时钟源的优选方案,可满足常规工业与消费场景的计时需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.