Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X49ST2-12.000-F20JGDT 为全国产化直插晶体元件,型号封装为 HC-49S-2P(直插式 HC-49S 直立封装)。标称振荡频率 12.000 MHz,常温频差 ±30 ppm,长期频率稳定度 ±50 ppm,等效串联电阻(ESR)约 50 Ω,推荐负载电容 20 pF,工作温度范围 -40 ℃ ~ +85 ℃。品牌:HCI(杭晶)。该器件适用于需要高稳定性、低成本的通用振荡源场合。
HC-49S-2P 为传统直插封装,安装时注意:引脚弯折应在离封装体适当距离进行,避免应力传递到封装体;焊接时建议采用常规手工或波峰焊工艺,控制焊接温度与时间以免长期高温影响频率稳定性;在电路板布线时,晶体附近走线应避免大电流回路,减少干扰并尽量靠近振荡器输入端放置负载电容与反馈元件,以获得最佳启动与相位噪声性能。
出厂通常经过筛选与老化测试以保证标称频差与稳定度。用户在设计验证阶段应进行:
选型时请核对频差、负载电容与工作温度要求,若电路对启动时间或相位噪声有更高要求,可与厂方沟通更严格规格或筛选等级。HC-49S-2P 直插封装便于替换与调试,适合样机验证与小批量生产。
如需更详细的电气等效电路参数、老化曲线或订购信息,建议联系 HCI(杭晶)或其授权分销商获取完整数据手册与测试报告。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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