WMSIC Electronic Components

HCI 0121M4-52.000F10HPNNL 0121M4

Model0121M4-52.000F10HPNNL
PackageSMD2016-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0121M4-52.000F10HPNNL
Type
SMD2016-4P
Minimum package
60 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0121M4-52.000F10HPNNL
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.029g
Frequency
52MHz
Electronic Component
1
Electronic Component
BM0265809194
Operating Temperature
20℃~+70℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
10pF
Frequency
±10ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0121M4-52.000F10HPNNL 贴片晶振产品概述

一、产品基本信息

0121M4-52.000F10HPNNL是杭晶电子(HCI) 推出的一款中性能贴片石英晶振,属于该品牌工业级入门系列。型号命名中:

  • “0121M4”对应封装及系列标识;
  • “52.000”明确核心工作频率;
  • “F10”代表负载电容参数;
  • “HPNNL”为品牌内部的性能编码。

该晶振主打“小封装+稳定精度”,适配多数对成本敏感但需可靠时钟的电子设备。

二、核心参数深度解析

1. 频率与精度指标

  • 基础频率:52MHz,是通信、工业控制领域的常见中频,可直接匹配多数MCU、射频芯片的时钟输入;
  • 常温频差:±10ppm(百万分之一),即25℃下频率偏差≤520Hz,满足一般精度需求(如数据传输、传感器采样);
  • 频率稳定度:±10ppm,指温度从-20℃到+70℃变化时,频率偏移仍控制在±10ppm内——这一参数直接决定设备在不同环境下的时钟稳定性(如户外设备的昼夜温差影响)。

2. 电气与环境参数

  • 负载电容:10pF(皮法),需在电路中并联对应容量的电容(建议NP0材质),否则会导致频率偏移;
  • 等效串联电阻(ESR):60Ω(欧姆),ESR越低起振越容易、信号损耗越小——60Ω在2016封装中属于中等偏优,适配8位/32位MCU的时钟输入;
  • 工作温度范围:-20℃~+70℃,覆盖一般工业环境(车间、户外非极端场景)、消费电子(智能家居、智能穿戴)的温度需求。

三、封装与物理特性

该晶振采用SMD2016-4P 封装,具体尺寸约为2.0mm(长)×1.6mm(宽)×0.8mm(高),4引脚贴片结构:

  • 兼容SMT自动化生产,适合小型化PCB设计;
  • 陶瓷封装材质,抗冲击、抗振动性能优于塑料封装;
  • 符合RoHS无铅环保标准,满足出口及国内环保要求。

四、典型应用场景

  1. 通信与物联网设备:蓝牙模块、WiFi模块、低功耗物联网网关——52MHz适配射频时钟及基带处理;
  2. 工业控制终端:小型PLC、传感器节点、数据采集器——稳定频率保证信号传输准确性;
  3. 消费电子:智能机顶盒、智能穿戴(手表/手环)、便携式医疗设备(血糖监测仪)——小封装节省空间;
  4. 车载信息娱乐系统:车载导航、中控屏辅助时钟——温宽满足车内常温环境(排除高温暴晒场景)。

五、性能优势与可靠性

  1. 成本与性能平衡:±10ppm精度无需温补,兼顾成本与稳定性;
  2. 起振可靠性:60Ω低ESR确保与多数MCU匹配,起振成功率高,避免设备“假死”;
  3. 品牌保障:杭晶电子是国内晶振老牌厂商,产品一致性好,售后配套完善;
  4. 小封装适配:2016封装可大幅压缩PCB空间,符合电子设备“轻薄化”趋势。

六、使用注意事项

  1. 负载电容匹配:必须用10pF NP0/C0G电容,避免温度系数不稳定的X7R电容;
  2. 焊接工艺:回流焊峰值温度≤260℃,焊接时间≤10秒,防止损坏石英晶片;
  3. 静电防护:佩戴防静电手环,使用防静电工作台,避免静电击穿;
  4. 储存条件:未焊接晶振储存在15~35℃、湿度≤60%环境,避免长期暴露在潮湿/极端温度下。

该晶振是中低端电子设备的高性价比时钟方案,若需更高温宽(如-40~+85℃)或更高精度(±5ppm),可选择杭晶同系列其他型号。

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