WMSIC Electronic Components

HCI 0132M4-8.000F15ATNGL 0132M4

Model0132M4-8.000F15ATNGL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0132M4-8.000F15ATNGL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0132M4-8.000F15ATNGL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.041g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264526997
Operating Temperature
55℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
15pF
Frequency
±50ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0132M4-8.000F15ATNGL 产品概述

一、产品简介

0132M4-8.000F15ATNGL 为 HCI(杭晶) 全国产化贴片金属晶振,采用 SMD3225-4P 封装(3.2×2.5mm,4 Pad),标称频率 8.000MHz。器件面向高可靠性、体积受限的消费电子、工业与物联网终端,兼顾成本与性能,适用于主控时钟和实时计时场景。

二、主要特点

  • 标称频率:8.000 MHz,频点精确稳定。
  • 常温频差:±10 ppm(常温校准出厂),频率稳定度:±50 ppm(在指定工作温度范围内)。
  • 负载电容:15 pF(用于匹配 MCU/振荡器电路)。
  • 等效串联电阻(ESR):100 Ω(典型上限)。
  • 工作温度范围:-55 ℃ 至 +85 ℃,适合工业级应用。
  • 全国产化生产,贴片金属外壳,便于自动贴装与回流焊接。

三、关键参数

  • 封装:SMD 3225-4P(4 Pads,便于定位与接地)。
  • 频率稳定性:±50 ppm(含温度漂移、老化等综合影响)。
  • 常温频差:±10 ppm(出厂校准标准)。
  • 负载电容:15 pF(建议在 PCB 设计中按此值配套匹配电容)。
  • ESR:≤100 Ω(保证振荡启动与稳幅)。
  • 温度:-55℃~+85℃(工业级)。

四、典型应用

  • ARM/MCU 系统主时钟与辅助时钟;
  • 实时时钟(RTC)与计时模块;
  • 无线通信模组、蓝牙/LoRa/低功耗 IoT 终端;
  • 消费类电子、车载仪表(非安全关键)、工业控制设备。

五、封装与安装

  • 建议焊盘与回流工艺:兼容标准 SMD 3225 回流温度曲线,避免超温与长时间保温。
  • 焊接注意:清洁焊盘,避免机械应力集中;在贴装与回流后建议进行功能测试以确认振荡启动。
  • PCB 布局建议:将晶振靠近 MCU 振荡输入引脚布置,并做好接地屏蔽以降低干扰;匹配 15 pF 负载电容并尽量缩短走线。

六、可靠性与注意事项

  • 推荐在实际应用中验证频率随温度与电源变化的表现,必要时进行电路级补偿。
  • 长期老化会引起频率微幅漂移,设计时留足余量以满足系统容差。
  • 存储与运输避免潮湿、高温与物理冲击。

七、采购与支持

HCI(杭晶) 品牌,支持批量供应与国产替代。订购时请确认型号、频率与负载电容等信息,必要时可联系厂商获取更详细的性能曲线、封装尺寸图与回流焊推荐曲线。

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