Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI 8132H-33.333ML33DTL 8132H
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 8132H-33.333ML33DTL
- Type
- HCI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 8132H-33.333ML33DTL
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Temperature-Compensated Crystal Oscillator (TCXO)
- Electronic Component
- 0.15g
- Frequency
- 33.333MHz
- Electronic Component
- 1
- Electronic Component
- BM0264568558
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 3.3V
- Output
- CMOS
- Frequency
- ±2ppm
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
8132H-33.333ML33DTL 产品概述
一、产品简介
8132H-33.333ML33DTL 是杭晶（HCI）出品的一款高精度温度补偿晶体振荡器（TCXO），中心频率为 33.333MHz，面向对频率精度与稳定性要求严格的通信、测量与时钟同步等领域。器件采用 SMD3225-4P 封装，体积小、易贴装，适合集成到空间受限的高密度电路板中。
二、主要技术参数
- 频率：33.333 MHz
- 频率稳定度（温度范围内）：±2 ppm
- 初始精度（出厂）：±1.5 ppm
- 输出方式：CMOS（逻辑电平输出，兼容 3.3V 逻辑）
- 工作电压：3.3 V
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装尺寸：3225（3.2 mm × 2.5 mm），4 引脚 SMD
三、关键特性与优势
- 高精度：出厂初始准确度达 ±1.5 ppm，可满足高精度时钟源需求；在工业温度范围内保持 ±2 ppm 的温度稳定性。
- CMOS 输出：直接驱动数字逻辑与 FPGA、MCU 等 3.3V 输入，简化外围电路设计。
- 小型化封装：3225 SMD 体积小，适合便携式设备及高密度板面布局。
- 工业温度等级：-40 ~ +85 ℃ 工作温度，适用于工业级与车规近端应用（请按具体认证和测试需求确认）。
- 良好可靠性：基于 TCXO 设计，针对温度漂移进行补偿，长期频率稳定性与抗扰动性能优良。
四、典型应用场景
- 无线基站、同步网元时钟源
- 精密测试与测量设备（示波器、频谱仪等）
- 通信基带、FPGA/ASIC 系统时钟
- GNSS 辅助参考时钟与高精度计时系统
- 工业控制与自动化设备
五、封装与引脚说明（典型）
3225-4P 封装，四引脚设计，典型引脚功能包括：VDD（3.3V 电源）、GND、OUT（CMOS 输出）、EN（使能/禁能）或 NC（无连接）。具体引脚排列与功能请以正式数据手册为准，建议在设计 PCB 时参考厂方推荐的焊盘尺寸与回流工艺。
六、使用建议与可靠性注意事项
- 供电滤波与旁路：为保证输出相位噪声与稳定性，应在 VDD 靠近器件位置放置 0.1 μF 陶瓷旁路电容并做良好接地。
- ESD 与浪涌保护：CMOS 输出对静电敏感，建议在生产与装配过程中采取防静电措施，必要时在系统端加入限流或保护电路。
- 封装热管理：虽然功耗较低，但在高温环境下应注意 PCB 热量分布以维持长期稳定性。
- 校准与筛选：对极限精度需求的系统，可在系统级进行校准或筛选以补偿剩余误差。
七、订购与技术支持
型号：8132H-33.333ML33DTL，品牌：HCI（杭晶），封装：SMD3225-4P。订购前请确认批量供货周期、ESD & 温度筛选等级以及是否需要定制标称频率或输出使能配置。更多详尽电气特性、引脚图与可靠性测试数据，请咨询杭晶官方技术支持或索取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
