WMSIC Electronic Components

HCI 3608S-32.768DTTLRRL 3608S

Model3608S-32.768DTTLRRL
PackageSMD8038-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 3608S-32.768DTTLRRL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
3608S-32.768DTTLRRL
Electronic Component
1
Package
SMD8038-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.209g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0265845461
Operating Temperature
40℃~+85℃
Electronic Component
±5ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Frequency
±5ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3608S-32.768DTTLRRL 贴片石英晶振产品概述

一、产品核心基础信息

3608S-32.768DTTLRRL为贴片石英晶振,核心频率为32.768kHz(实时时钟(RTC)、计时系统的标准参考频率),由国内知名晶振厂商杭晶(HCI) 生产,采用SMD8038-4P 封装(尺寸约8.0×3.8mm,4引脚贴片式),适配自动化贴装工艺,可直接集成于各类电子设备的PCB布局中。

二、关键性能参数解析

该晶振的性能参数围绕“低功耗、高精度、宽温稳定”设计,核心参数及意义如下:

  1. 频率精度与稳定度:常温频差±5ppm,工作温度范围内(-40℃~+85℃)频率稳定度±5ppm——换算成年误差约2.6分钟,可满足消费电子、工业控制等场景的计时精度需求;
  2. 负载电容:12.5pF——晶振振荡需匹配该值的等效负载电容,电路设计中需通过外部电容(结合寄生电容)调整至该参数,保证频率准确;
  3. 等效串联电阻(ESR):50Ω——较低的ESR可降低振荡电路功耗,提升振荡可靠性,减少因电阻过大导致的停振风险;
  4. 工作温度范围:-40℃~+85℃——覆盖工业级宽温环境,可在户外、车间等温差较大的场景稳定工作;
  5. 封装与引脚:SMD8038-4P(4引脚贴片)——体积小巧,适配高密度PCB布局,4引脚设计可优化接地与信号隔离。

三、典型应用场景

32.768kHz是低功耗计时系统的核心频率,该晶振适用于以下场景:

  • 消费电子:智能手表、手环、智能家居设备的RTC模块,实现精准计时与低功耗运行;
  • 工业控制:PLC、传感器节点、工业物联网网关的时间同步与定时控制,适应宽温环境;
  • 通信设备:路由器、交换机、基站的时钟同步,保障数据传输时序准确性;
  • 物联网终端:NB-IoT、LoRa等低功耗无线节点的定时唤醒与数据同步,延长设备续航;
  • 汽车电子:车载中控、仪表盘的计时功能(宽温范围可覆盖部分车载场景)。

四、产品优势与可靠性

  1. 高精度稳定:±5ppm的频差与温度稳定度,避免温度变化导致的计时偏差,适合长期运行的计时系统;
  2. 宽温适应性:-40℃~+85℃的工作范围,可替代窄温晶振,减少环境适配成本;
  3. 低功耗设计:低ESR(50Ω)+32.768kHz低频特性,配合振荡电路可实现微安级功耗,适配电池供电设备;
  4. 品牌质量保障:杭晶(HCI)为国内晶振行业头部厂商,产品经过振动、冲击、老化等严格测试,性能稳定;
  5. 工艺兼容性:SMD8038-4P封装适配主流回流焊、波峰焊工艺,可直接用于自动化生产线,提升生产效率。

五、应用设计注意事项

  1. 负载电容匹配:需在晶振引脚与振荡电路间配置外部电容,使总负载电容(外部电容+电路寄生电容)=12.5pF(通常采用两个12.5pF电容并联到地,或根据寄生电容调整);
  2. 焊接工艺控制:遵循HCI官方推荐参数(峰值温度240℃~250℃,时间≤10秒),避免高温损坏石英晶体;
  3. 电源滤波:振荡电路电源需增加10μF+0.1μF滤波电容,减少电源纹波对频率的影响;
  4. 布局优化:晶振靠近振荡IC引脚,缩短走线长度,避免电磁干扰(EMI)影响频率稳定性。

该晶振凭借“高精度、宽温、低功耗”的核心优势,可广泛适配消费电子、工业、物联网等多领域的计时与同步需求,是低成本高性能晶振的优选方案。

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