WMSIC Electronic Components

HCI 8132H-25.000NL33DTL 8132H

Model8132H-25.000NL33DTL
PackageSMD3225-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 8132H-25.000NL33DTL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
8132H-25.000NL33DTL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Temperature-Compensated Crystal Oscillator (TCXO)
Electronic Component
0.045g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0264982137
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Output
CMOS
Frequency
±2ppm
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

8132H-25.000NL33DTL 产品概述

一、产品简介

8132H-25.000NL33DTL 是杭晶(HCI)推出的一款高稳定性石英晶振器,标准频率为 25.000 MHz。器件采用 SMD3225-4P 小型贴片封装,输出为 CMOS 电平,工作电压 3.3V,工作温度范围 -40℃ 至 +85℃,频率稳定度优异(±2 ppm),适用于对频率准确性和长期稳定性要求较高的电子系统。

二、主要参数

  • 频率:25.000 MHz
  • 频率稳定度:±2 ppm(工作温度范围内)
  • 输出模式:CMOS(推挽输出,3.3V 兼容)
  • 工作电压:3.3 V ±(依据系统供电规范)
  • 工作温度:-40℃ ~ +85℃(工业级)
  • 封装:SMD3225-4P(3.2 mm × 2.5 mm,4 引脚)

三、产品特点与优势

  • 高频率精度高:±2 ppm 的频率稳定度在工业级应用中表现出色,有助于降低系统的时钟漂移与同步误差。
  • 3.3V CMOS 输出:直接与常见的微控制器、FPGA、网络芯片等 3.3V 电平接口兼容,无需额外电平转换。
  • 小体积封装:SMD3225-4P 提供紧凑的 PCB 布局空间,便于高密度组装与便携设备应用。
  • 工业温度范围:-40℃~+85℃ 适应多种环境条件,适合工业控制、通信及网络设备等场景。
  • 兼容现代 SMT 工艺:适用于常规回流焊工艺,便于批量生产与贴装流程整合。

四、典型应用场景

  • 通信设备:基站设备、以太网交换机、光纤收发模块等需要高稳定时钟的场合。
  • 网络与服务器:路由器、网络接口卡、时间同步模块等。
  • 嵌入式系统:单片机、FPGA/SoC 时钟源,用于数据采集、控制与计时。
  • 工业自动化:PLC、运动控制、工业以太网等对温度变化敏感的系统。
  • 测试与测量设备:示波器、频谱分析仪、计时设备中作为参考时钟。

五、封装与使用建议

  • 封装说明:SMD3225-4P 为 4 引脚贴片晶振,尺寸 3.2 × 2.5 mm,建议参考厂方提供的 PCB land pattern 布局以保证焊接可靠性及电性能。
  • 焊接工艺:兼容常规无铅回流焊,请遵循温度曲线与回流工艺规范;避免长时间高温暴露。
  • 布局注意事项:晶振附近保持适当的地平面,尽量远离大电流开关节点和高速信号线以降低干扰;输出侧建议加去耦或阻尼网络以抑制反射和 ringing(根据系统需要选择)。
  • 防护与储存:按常规静电防护措施操作,储存环境避免高湿高温,按厂方建议保存期限和条件管理库存。

六、选型与支持

8132H-25.000NL33DTL 适合对频率精度与环境适应性有较高要求的工业及通信类产品。若需更详细的电气特性、封装图纸、推荐贴片尺寸或样品测试数据,请联系杭晶(HCI)或其授权代理商获取相关技术资料与支持。

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