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HCI CO75D6-200.000-18JDTST CO75D6
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI CO75D6-200.000-18JDTST
- Type
- HCI
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- CO75D6-200.000-18JDTST
- Electronic Component
- 1
- Package
- SMD7050-6P
- Electronic Component
- Active Crystal Oscillator
- Electronic Component
- 0.73g
- Frequency
- 200MHz
- Electronic Component
- 1
- Electronic Component
- BM0264779323
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.8V
- Electronic Component
- ±10ppm
- Output
- LVDS
- Frequency
- ±15ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CO75D6-200.000-18JDTST 产品概述
一、产品简介
CO75D6-200.000-18JDTST 是杭晶（HCI）推出的一款低抖动差分有源晶振，标称频率 200MHz，输出为 LVDS 差分信号，工作电压 1.8V。器件采用 SMD7050-6P 封装，针对工业级温度范围设计，适用于高要求的时钟源场合。
二、主要参数
- 频率：200.000 MHz
- 输出模式：LVDS 差分
- 工作电压：1.8V
- 常温频差：±10 ppm
- 频率稳定度（含温度与老化等）：±15 ppm
- 工作温度：-40℃ ~ +85℃
- 封装：SMD7050-6P，6 引脚（SMD）
三、性能特点
- 极低相位抖动：专为高速数据传输与精密时序设计，具备优异的相位噪声与抖动特性，提升串行链路和数据转换精度。
- 差分输出稳定：LVDS 差分输出抗干扰能力强，信号完整性好，利于长线传输与高频板级互连。
- 低功耗工作：1.8V 供电，适配低压系统，利于节能与电源规划。
- 宽温稳定性：-40℃~+85℃ 工作温度范围，满足工业级可靠性要求。
四、典型应用
适用于要求高稳定性与低抖动的场合，如高速通信（SerDes、光模块）、FPGA 时钟、ADC/DAC 同步时钟、网络设备、测试测量仪器以及工业控制等领域。
五、封装与可靠性
SMD7050-6P 表面贴装封装，适配标准回流焊工艺，便于自动化组装与批量生产。杭晶（HCI）在制造与质量控制上具有成熟经验，可提供相关技术支持与出货检验报告。
如需样品、详细时序图或完整数据手册，请联系供应商或杭晶技术支持，以获得进一步的电气特性曲线与应用建议。
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