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Walsin 1210B225K101CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- (Walsin) 1210B225K101CT
- Type
- 1210
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- 1210B225K101CT
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0264549894
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1210B225K101CT 产品概述
一、产品简介
1210B225K101CT 为华新科（Walsin）片式多层陶瓷电容器，封装尺寸为 1210（约 3.2 × 2.5 mm），标称电容量 2.2 μF，公差 ±10%，额定电压 100 VDC，介质型号 X7R。该类陶瓷电容在工业电源与功率电子领域常用于中高压旁路、滤波与储能场合，兼顾体积与电容量，适合表面贴装工艺。
二、主要参数
- 容值：2.2 μF（±10%）
- 额定电压：100 VDC
- 温度特性：X7R（-55°C 至 +125°C，温度依赖性允许范围）
- 封装：1210（3225公制）
- 封装形式：片式，适用 SMT 回流焊
三、特点与优势
- 面积/容量比高：在 1210 封装下可获得较大电容量，节省 PCB 面积。
- 温度稳定性较好：X7R 在宽温范围内保持稳定性能（相比 Y5V 类更佳）。
- 高频性能：低等效串联电感（ESL）与低等效串联电阻（ESR），适合高频去耦。
- 可靠性与可批量生产：符合常见工业级测试规范，适合自动化贴装与回流焊接。
四、典型应用
- 开关电源输出滤波与储能
- 高压 DC/DC 转换器旁路与退耦
- 工业控制、电机驱动与电源管理
- 汽车电子（需按 AEC 要求另行确认）
- 充电与能量回馈场合的高压滤波（结合其他电容并用）
五、设计与使用建议
- DC 偏压影响：陶瓷介质在高直流电压下会产生显著的电容量下降，实际工作电容应参考厂商的电压-电容曲线；在关键电路中建议适当降额（常见设计经验为 50%~80% 的降额范围，具体按曲线与可靠性要求确定）。
- 并联使用：为了覆盖更宽的频率范围与增加等效纹波承受能力，可与小容量低 ESL 的电容并联使用。
- 布局建议：靠近电源端子或器件电源引脚放置，短且宽的焊盘与走线，必要时采用多焊盘或过孔分散回流路径以降低寄生阻抗。
六、焊接、存储与可靠性
- 推荐采用符合 JEDEC/J-STD-020 的回流焊工艺；注意预热与温度坡度以避免裂纹风险（常见回流峰值温度≤260°C）。
- 存储时宜保持干燥，避免机械应力与剧烈温变；贴片电容对机械冲击与弯曲敏感，贴装后避免在 PCB 上施加过大弯曲力。
- 在有严苛可靠性要求的应用（如航空、汽车关键部位），建议参照厂方的加速寿命与机械应力试验数据进行验证。
七、封装与订购信息
- 交付形式通常为带卷盘（Tape & Reel），便于 SMT 贴装机直接上料。
- 订购时请确认完整料号、批次与相关规格书（尤其电压-电容特性曲线、温度系数与老化/寿命测试数据），以确保在目标应用中的性能与可靠性满足要求。
如需器件的电压-电容曲线、等效串联电阻/RDF、典型纹波电流或详细封装尺寸与焊盘建议图，请告知，我可进一步提供或帮您解读厂家数据手册。
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