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Hottech SI2300
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech SI2300
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- SI2300
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0227655803
- Power Dissipation(Pd)
- 1.25W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 888pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SI2300 产品概述
一 概述
SI2300 是 Hottech（合科泰）提供的一款小尺寸 SOT-23 封装 N 沟道场效应管，面向便携电源与功率管理场景。该器件额定漏源电压 Vdss = 20V，低导通电阻与较小封装使其适合用作低电压开关、负载开关和同步整流等应用。器件在不同驱动电压下表现良好：在 Vgs = 4.5V 时典型 RDS(on) = 40mΩ，在 Vgs = 2.5V 时约为 60mΩ，兼顾逻辑电平驱动能力与低导通损耗。
二 主要参数（关键规格）
- 类型：N 沟道 MOSFET，封装 SOT-23
- 漏源耐压：Vdss = 20V
- 连续漏极电流：Id ≈ 3.8A（器件散热受限）
- 峰值/脉冲电流：描述中提及可达 4–5A（应参照实际应用与脉冲条件）
- 导通电阻：RDS(on) = 40mΩ @ Vgs = 4.5V；约 60mΩ @ Vgs = 2.5V
- 阈值电压：Vgs(th) = 780mV @ Id = 250µA
- 总栅电荷：Qg = 16.8nC @ Vgs = 10V（用于估算驱动能量）
- 输入/输出/反向传输电容：Ciss = 888pF、Coss = 144pF、Crss = 115pF
- 功耗：Pd = 1.25W（SOT-23，取决于 PCB 散热）
三 电气与热设计注意事项
- 封装 Pd = 1.25W 意味着在无额外散热的 PCB 上连续高电流工作受限，需通过增加铜箔面积或散热层提高功率耗散能力。
- 在高电流或高占空比工况，注意结温上升会降低持续电流能力并增加 RDS(on)。建议热仿真或实际测量确认结温。
- 母线电压接近 20V 时切勿超过器件额定 Vdss，并严格遵守数据手册中 Vgs 最大值限制（以免栅极击穿）。
四 驱动与开关性能
- Qg = 16.8nC（10V）表明需要中等驱动能力的驱动器；若使用 MCU 直接驱动（3.3V/5V），需评估上升/下降时间及开关损耗。
- Ciss、Crss 值提示存在明显 Miller 电容效应，开关过程中 Miller plateau 会影响栅极电压过渡，建议使用带有有限驱动电流能力的驱动器以缩短切换时间并控制振铃。
- 在 2.5–4.5V 驱动范围内，器件为“准逻辑电平”，适合 2.5V/3.3V/5V 系统，但更低的 Vgs 会明显增大导通损耗。
五 PCB 布局与封装热管理
- SOT-23 封装焊盘应尽量扩大与散热铜箔连接，增加底层散热面积并使用多层过孔以导出热量。
- 引脚与走线尽量短并增宽，减小寄生电感与电阻，尤其是漏极与源极回路。
- 在高频开关方案中，栅极回路应尽量靠近驱动器，放置阻尼电阻或 RC 抑制振铃。
六 典型应用
- 电池供电设备中的低压负载开关与电源隔离。
- 降压型 DC-DC 转换器（低侧开关或需要配合驱动器的高侧方案）。
- USB/接口电源控制、便携式充电设备、背光驱动开关等需低导通损耗的小功率电源开关场景。
七 建议与结论
SI2300 在 SOT-23 封装中提供了兼顾逻辑电平驱动与较低导通电阻的解决方案，适合空间受限且功率要求中等的设计。设计时应重视散热与驱动能力，合理选用 PCB 铜量和驱动器以获得最佳效率与可靠性。欲获得完整电气特性、极限值及典型波形，请参照 Hottech 官方数据手册进行最终设计验证。
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