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Hottech BSS138
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech BSS138
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- BSS138
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0227772938
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 50V
- Capacitor(Ciss)
- 58pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSS138产品概述
一、产品概况
BSS138 为一款低电压、小封装的N沟道场效应管（MOSFET），由 Hottech（合科泰）出品。器件采用SOT-23三引脚表面贴装封装，适用于空间受限、功耗受控的电子设计。其主要定位为小电流开关与信号级电平转换等低功耗应用。
二、关键参数
- 漏源耐压（Vdss）：50 V
- 连续漏极电流（Id）：220 mA（常温）
- 导通电阻（RDS(on)）：2 Ω @ Vgs = 2.5 V, Id = 0.05 A
- 最大耗散功率（Pd）：350 mW
- 门阈电压（Vgs(th)）：1.2 V
- 输入电容（Ciss）：58 pF
- 反向传输电容（Crss）：5.2 pF
- 工作温度范围：-55 ℃ ~ +150 ℃
- 封装：SOT-23（表面贴装）
三、主要特性与优势
- 低门阈电压（约1.2 V），便于与低电压逻辑直接驱动；
- 较小的输入电容（Ciss 58 pF）有利于快速开关和降低驱动能量，适合中高频率信号切换；
- SOT-23小体积封装，有利于高密度PCB布局与便携式设备应用；
- 50 V 的漏源耐压为多数小功率开关应用留有一定裕量。
四、典型应用场景
- 低电流负载开关与通断控制；
- 双向/单向逻辑电平转换（如 I/O 电平匹配、总线接口）；
- 信号开关、复用器前端；
- 便携式与电池供电设备中的电源管理与保护电路。
五、使用与布局建议
- 注意功耗管理：SOT-23 封装的耗散功率为 350 mW，实际应用中需考虑PCB铜箔散热与环境温度，必要时在PCB上增加散热铜箔以降低结温；
- 驱动与保护：门极驱动电压不应超过器件允许范围（参考厂商完整数据手册），使用上拉/限流电阻可抑制瞬态和振铃；
- 噪声与开关抑制：尽管输入电容较小，但在高 dV/dt 场合仍建议加R-C缓冲或斜率控制以减少干扰；
- ESD 与焊接：作为小信号MOSFET，注意静电防护及焊接热循环对封装和性能的影响。
六、封装与采购提示
- 封装形式：SOT-23，便于自动贴装与回流焊工艺；
- 品牌：Hottech（合科泰），订购时请核对完整型号与出货规格书，确认批次与合格证书以确保一致性。
七、注意事项
- 标注的RDS(on) 条件为 Vgs = 2.5 V、Id = 0.05 A，实际在更高电流或不同驱动电压下导通电阻会变化；
- 切勿超过 50 V 漏源电压上限与器件的最大允许结温；在高环境温度或连续负载下需做热降额设计；
- 如需精确参数（例如最大Vgs、击穿特性、动态开关能量等），请参阅厂商完整数据手册以获得详尽试验条件与典型曲线。
以上为基于器件基本参数整理的产品概述，便于快速评估BSS138在设计中的适配性与注意要点。若需进一步的电路示例、仿真模型或与其它型号的对比分析，可提供具体应用场景以便深入说明。
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