WMSIC Electronic Components

Hottech S9015

ModelS9015
PackageSOT-23
BrandHottech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Hottech S9015
Type
HOTTECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOTTECH
Electronic Component
S9015
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0228550669
Transistor Type
PNP
Frequency(f T)
150MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9015 产品概述

一、概述

S9015 是一款面向低功耗信号与开关应用的 PNP 双极晶体管(BJT),由 Hottech(合科泰)提供,封装为 SOT-23。器件具有 45V 的集电极-射极击穿电压和 100mA 的最大集电极电流,适用于便携式电子、音频前级、逻辑电平转换及一般开关场合。

二、主要规格

  • 晶体管类型:PNP
  • 最大集电极电流 Ic:100 mA
  • 集-射击穿电压 Vceo:45 V
  • 最大耗散功率 Pd(Ta=25°C):200 mW
  • 直流电流增益 hFE:≈1000(测试条件:Ic=1 mA, Vce=5 V,低电流时增益很高)
  • 特征频率 fT:150 MHz(适合高频小信号放大)
  • 集电极截止电流 Icbo:100 nA(常温,低漏电)
  • 饱和电压 VCE(sat):约 300 mV(测试条件下,Ic=100 mA, IB=10 mA 的强迫饱和)
  • 射基极击穿电压 Vebo:5 V
  • 封装:SOT-23,单只包装

三、产品特点与优势

  • 低电流下极高的直流增益,便于小信号放大与电平检测。
  • 150 MHz 的 fT 支持高频小信号应用(需考虑增益随频率下降)。
  • 电流漏泄小(Icbo≈100 nA),利于高阻输入和低功耗设计。
  • SOT-23 小尺寸封装,适合空间受限的移动设备和表面贴装工艺。

四、注意事项与应用建议

  • 热管理:封装限功 200 mW,请在 PCB 设计中通过增加铜枕或散热片扩展散热面积,避免长期接近最大耗散。
  • 饱和驱动:若用于开关为确保低 VCE(sat),需提供足够基极驱动电流(例如强迫 β≈10 时的测试条件);对电池供电场合应在能耗和饱和电压间权衡。
  • 基-射极极限:Vebo 为 5 V,应避免反向施加过高电压,以免损坏结。
  • 引脚与封装:SOT-23 常见引脚排列会因厂商略有差异,实际电路连接前请参照厂家数据手册或丝印核对引脚定义。
  • ESD 与焊接:为保证可靠性,请在 SMT 焊接和储存过程中注意防静电与湿敏管控。

五、典型应用场景

  • 小信号放大:前级放大、检测放大器。
  • 开关控制:低电流开关、驱动小型继电器或指示灯(需关注功耗与饱和损耗)。
  • 电平转换与互补对管:与常见 NPN 器件配合形成推挽或互补电路。
  • 移动设备与消费电子中的信号处理与控制电路。

如需完整电气特性曲线、引脚图与封装尺寸,请参考 Hottech 官方数据手册,以便在实际设计中准确评估管脚连接和热性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.