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Hottech 2SC3356
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech 2SC3356
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- 2SC3356
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0227655752
- Transistor Type
- NPN
- Frequency(f T)
- 7GHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 100mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2SC3356 产品概述
一、概述与主要性能
2SC3356 为 NPN 小信号晶体管，Hottech（合科泰）品牌，SOT-23 封装。器件在典型工作点（Ic＝20mA、Vce＝10V）下直流电流增益 hFE ≈ 300，特征频率 fT 为 7GHz，集电极电流最大值 100mA，集射极击穿电压 Vceo 为 12V，耗散功率 Pd 为 200mW，射基极击穿电压 Vebo 为 3V，集电极截止电流 Icbo 典型 1µA。总体来看，该器件为低电压、低功耗且具有较高频率特性的通用 NPN 放大单元。
二、典型应用场景
- 射频/宽带小信号放大：fT=7GHz 使其适用于 VHF 至低 GHz 频段的前置放大与增益补偿。
- 高频振荡与混频级：在低电压供电环境下可用作振荡器或混频器的增益单元。
- 开关与缓冲：在低功耗控制回路中作为开关或驱动用放大器。
- 一般小信号放大与信号整形电路。
三、电气特性要点与选型注意
- 电压与电流限制：Vceo = 12V，Ic 最大 100mA，实际使用时应留裕量，避免靠近击穿区工作。
- 功率与热限：Pd = 200mW（SOT-23），需按 PCB 散热条件进行降额。长时间工作建议将功耗控制在额定值的 50–70% 以下。
- 极限保护：Vebo = 3V 表明基极对发射极的反向电压耐受较低，静电与反向偏置要做好保护。
- 漏电与噪声：Icbo ≈ 1µA，适合对漏电流敏感的低电流应用，但在高温下漏电会增加，应在数据手册条件下验证。
四、热管理与封装要求
SOT-23 小封装散热受限，建议优化铜箔散热（增加焊盘面积、接地铜皮），并避免在高环境温度下持续满功率运行。焊接采用常规回流工艺，注意不要超过封装的峰值回流温度限制。
五、典型电路与使用建议
- 偏置：采用分压偏置加串联发射电阻以稳定工作点，发射电阻同时有助于改善线性与温漂。
- 频率补偿：高频应用中注意输入/输出阻抗匹配，采用适当的旁路电容和阻尼网络减少寄生振荡。
- 保护：在基极增加限流电阻和 TVS/二极管以防反向击穿；在集电极侧设置限流或热关断方案以防过载。
六、采购与质量关注
Hottech（合科泰）品牌标识，单只包装为 SOT-23。采购时建议索取完整数据手册与热阻参数，关注原厂或授权分销渠道以确保品质一致，并做到来料测试（hFE、Vceo、Icbo 等关键参数抽检）以保证批次性能稳定。
总结：2SC3356 在小封装和低电压应用中提供了较高的增益与可用带宽，适合中高频的小信号放大与射频前端应用，但需重视散热、基极反向保护与实际工作点的降额设计以确保长期可靠性。
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