WMSIC Electronic Components

Hottech SS24

ModelSS24
PackageSMB
BrandHottech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Hottech SS24
Type
HOTTECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOTTECH
Electronic Component
SS24
Electronic Component
1
Package
SMB
Electronic Component
Schottky Diode
Electronic Component
0.2g
Electronic Component
1
Electronic Component
BM0227648935
Current
2A
Diode
1
Current(Ir)
500uA@40V
(Vf)
550mV@2A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS24(Hottech 合科泰)产品概述

一、产品简介

SS24 为 Schottky 肖特基整流二极管,单个独立结构造(1个独立式),由 Hottech(合科泰)生产,封装为 SMB。该器件针对中等功率开关电源与整流应用设计,兼顾低正向压降与良好的高频开关特性,适用于空间有限但需 2A 连续整流能力的场合。

二、电气参数

  • 正向压降(Vf):0.55V @ If = 2A(典型值),保证较低的功率损耗与发热。
  • 直流反向耐压(Vr):40V,适合 12V/24V 系统的回流与保护。
  • 整流电流(Io):2A 连续工作电流(散热条件良好时)。
  • 反向电流(Ir):500µA @ Vr = 40V(最大),反向漏电在高温或高压下需关注功耗与系统漏电。
  • 非重复峰值浪涌电流(Ifsm):50A,能承受开机/短时浪涌及突发冲击电流。
  • 工作结温范围:-55°C ~ +125°C,适应较宽的环境温度变化。

三、封装与热特性

SMB 封装提供较好的焊接强度与散热路径,适合自动贴装。实际允许的连续电流与结温、PCB 铜箔面积、通风条件密切相关;推荐在设计中提供足够的散热铜箔并靠近散热板或采用过孔技术降低结温。封装对耐冲击与机械应力有一定保护,但仍应避免过度机械拉扯。

四、主要应用场景

  • 开关电源(SMPS)输入或输出整流。
  • 车载电子(12V/24V 系统)反向保护与整流。
  • DC-DC 转换器续流二极管。
  • 电池充放电管理、UPS、家电控制电路中的快速整流。
    其低 Vf 特性在高效率设计中可明显降低整流损耗,浪涌承受能力使其在含感性负载的场合更为可靠。

五、可靠性与使用建议

  • 在高温高压条件下,注意反向漏电增加对系统空载损耗的影响。
  • 若工作在接近额定 Io 或频繁浪涌场景,建议留有安全余量或选用更大额定值器件以延长寿命。
  • 焊接时遵循SMB封装的回流温度曲线,避免过热引起封装应力或内部连接损伤。
  • 储存与装配环境应防潮,避免表面氧化影响焊接品质。

六、订购与替代建议

标称型号:SS24,品牌:Hottech(合科泰),封装:SMB。若需更低漏电或更高电压版本,可考虑 SS14/SS34 系列的电压/电流不同等级,或选择相同规格的其他厂商肖特基作交叉参考。选型时请参考完整数据手册以校核温升、封装尺寸及热阻等关键参数。

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