Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Hottech SS24
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech SS24
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- SS24
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.2g
- Electronic Component
- 1
- Electronic Component
- BM0264721622
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@2A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS24（Hottech 合科泰）产品概述
一、产品简介
SS24 为 Schottky 肖特基整流二极管，单个独立结构造（1个独立式），由 Hottech（合科泰）生产，封装为 SMB。该器件针对中等功率开关电源与整流应用设计，兼顾低正向压降与良好的高频开关特性，适用于空间有限但需 2A 连续整流能力的场合。
二、电气参数
- 正向压降（Vf）：0.55V @ If = 2A（典型值），保证较低的功率损耗与发热。
- 直流反向耐压（Vr）：40V，适合 12V/24V 系统的回流与保护。
- 整流电流（Io）：2A 连续工作电流（散热条件良好时）。
- 反向电流（Ir）：500µA @ Vr = 40V（最大），反向漏电在高温或高压下需关注功耗与系统漏电。
- 非重复峰值浪涌电流（Ifsm）：50A，能承受开机/短时浪涌及突发冲击电流。
- 工作结温范围：-55°C ~ +125°C，适应较宽的环境温度变化。
三、封装与热特性
SMB 封装提供较好的焊接强度与散热路径，适合自动贴装。实际允许的连续电流与结温、PCB 铜箔面积、通风条件密切相关；推荐在设计中提供足够的散热铜箔并靠近散热板或采用过孔技术降低结温。封装对耐冲击与机械应力有一定保护，但仍应避免过度机械拉扯。
四、主要应用场景
- 开关电源（SMPS）输入或输出整流。
- 车载电子（12V/24V 系统）反向保护与整流。
- DC-DC 转换器续流二极管。
- 电池充放电管理、UPS、家电控制电路中的快速整流。
其低 Vf 特性在高效率设计中可明显降低整流损耗，浪涌承受能力使其在含感性负载的场合更为可靠。
五、可靠性与使用建议
- 在高温高压条件下，注意反向漏电增加对系统空载损耗的影响。
- 若工作在接近额定 Io 或频繁浪涌场景，建议留有安全余量或选用更大额定值器件以延长寿命。
- 焊接时遵循SMB封装的回流温度曲线，避免过热引起封装应力或内部连接损伤。
- 储存与装配环境应防潮，避免表面氧化影响焊接品质。
六、订购与替代建议
标称型号：SS24，品牌：Hottech（合科泰），封装：SMB。若需更低漏电或更高电压版本，可考虑 SS14/SS34 系列的电压/电流不同等级，或选择相同规格的其他厂商肖特基作交叉参考。选型时请参考完整数据手册以校核温升、封装尺寸及热阻等关键参数。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
