WMSIC Electronic Components

Hottech BZX84C8V2

ModelBZX84C8V2
PackageSOT-23
BrandHottech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Hottech BZX84C8V2
Type
HOTTECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOTTECH
Electronic Component
BZX84C8V2
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
0.03g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
15Ω
Electronic Component
BM0265582297
Diode
1
Current(Ir)
700nA
Power Dissipation(Pd)
350mW
Electronic Component
7.7V~8.7V
Electronic Component
65℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84C8V2稳压二极管产品概述

一、产品核心定位与功能特性

BZX84C8V2是合科泰(Hottech)推出的独立式稳压二极管,核心作用是为电子电路提供稳定的8.2V基准电压,属于超小型贴片稳压器件,适配对空间、功耗敏感的系统。其工作原理基于反向齐纳击穿:当二极管反向电压达到稳压值时,两端电压保持稳定,可作为电压基准、过压保护或辅助稳压元件使用,无需额外驱动电路,使用简单。

二、关键电气参数深度解析

1. 稳压值与公差范围

  • 标称稳压值(Vz):8.2V(电路设计的基准参考值);
  • 实际稳压范围:7.7V~8.7V(±6.1%公差),该范围由生产工艺一致性控制,满足多数通用电路的稳压需求(无需高精度基准时可直接选用)。

2. 反向漏电流(Ir)

反向漏电流为700nA(纳安级),属于极低水平。该参数直接影响稳压管截止状态下的功耗:当稳压管反向未击穿时,漏电流越小,电路静态功耗越低,尤其适合电池供电的便携式设备(如蓝牙耳机、智能手环)。

3. 最大耗散功率(Pd)

额定耗散功率为350mW,是器件能持续承受的最大功率(超过此值可能导致结温过高损坏)。结合标称稳压值计算,其最大允许负载电流约为42.7mA(I_max = Pd / Vz ≈ 350mW / 8.2V),可覆盖多数小型电路的负载需求(如LED驱动、传感器供电稳压)。

4. 工作结温范围

支持**-65℃+150℃宽温工作**,远超普通民用级器件(通常-40℃+85℃),适合工业控制、车载电子(部分场景)等恶劣环境(温度波动大、高低温交替)。

三、封装与物理特性

该产品采用SOT-23封装(用户描述明确),属于超小型贴片封装,尺寸约为2.9mm×1.6mm×1.1mm,具有以下优势:

  • 节省空间:适配高密度电路设计(如智能手机主板、小型通信模块);
  • 自动化贴装:符合SMT生产工艺,降低生产难度与成本;
  • 散热可控:虽封装小,但Pd仅350mW,正常工作下结温可通过PCB铜箔散热,无需额外散热片。

四、品牌与可靠性支撑

合科泰(Hottech)是国内专注于分立器件的知名厂商,产品可靠性通过以下方式保障:

  • 工艺一致性:稳压值公差、漏电流等参数一致性达标,减少批量应用中的性能差异;
  • 宽温测试:出厂前经过-65℃~+150℃循环测试,确保高低温下性能稳定;
  • 行业标准:满足GB/T 14023等分立器件标准,适配通用电路设计规范。

五、典型应用场景

  1. 便携式电子:手机、智能手表、蓝牙耳机的电源辅助稳压(低漏电流降低静态功耗);
  2. 工业控制:PLC模块、传感器节点的电压基准(宽温范围适配工业环境);
  3. 消费电子:充电器、LED台灯的过压保护/稳压(小封装节省空间);
  4. 通信模块:蓝牙、WiFi模块的电源稳压(低功耗匹配无线通信需求)。

六、选型与使用注意事项

  1. 负载电流限制:实际负载电流需低于42.7mA,避免功率超Pd;
  2. 温度裕量:环境温度接近150℃时,需适当降低负载电流(结温过高加速老化);
  3. 精度适配:若需±1%以内高精度,需搭配运放补偿(该产品为通用精度);
  4. 焊接规范:SOT-23封装焊接温度≤260℃,时间≤3秒,避免损坏器件。

该产品以“小封装、低功耗、宽温稳定”为核心优势,是通用电路中8V级稳压的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.