Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
Hottech(合科泰)作为国内功率半导体领域的成熟厂商,其推出的1N5817W属于低压肖特基整流二极管,凭借低正向压降、快速开关特性及小型化封装,精准适配消费电子、工业控制等低压场景的整流需求,是传统硅整流管的高效替代方案。
1N5817W针对低压直流整流场景设计,核心差异于普通硅整流管的特性为开关速度快(恢复时间<100ns)、正向压降低,尤其适合高频或低功耗应用。Hottech(合科泰)深耕功率器件多年,产品覆盖整流二极管、MOS管等系列,符合RoHS、REACH等环保标准,其器件经多轮工业级可靠性测试,可满足不同应用的长期稳定性要求。
需注意用户输入中反向电流(Ir)存在单位笔误(行业常规为μA级别),修正后核心参数及说明如下:
参数项 规格(典型值/最大值) 关键说明 正向压降(Vf) 750mV @ 3.0A(直流) 比普通硅整流管(约1V@1A)压降低25%,提升电源效率 直流反向耐压(Vr) 20V(最大值) 低压肖特基典型耐压,适配5V/12V等低压系统 平均正向整流电流(If) 1A(最大值,Ta=25℃) 连续工作额定电流,需预留20%裕量 反向漏电流(Ir) 25μA @ 20V(典型值) 修正用户笔误(原25A为不合理值),低漏电流减少静态功耗 非重复峰值浪涌电流(Ifsm) 25A(最大值,t=8.3ms) 单次瞬时浪涌耐受能力,应对开机冲击、负载突变等场景 工作结温范围 -55℃ ~ +150℃ 工业级宽温范围,适应极端环境(如车载、户外设备)1N5817W采用SOD-123表面贴装封装,尺寸为2.9mm×1.6mm×1.1mm(典型值),具备以下核心优势:
结合1N5817W的低压、小电流特性,其核心应用场景包括:
为保证1N5817W的长期稳定工作,需注意以下要点:
1N5817W的核心竞争力体现在:
该产品可作为1N5817系列的表面贴装替代方案,广泛适配低压整流需求,是消费电子与工业控制领域的高性价比选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products