WMSIC Electronic Components

Hottech BZT52C5V1

ModelBZT52C5V1
PackageSOD-123
BrandHottech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Hottech BZT52C5V1
Type
HOTTECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOTTECH
Electronic Component
BZT52C5V1
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.034g
Electronic Component
1
(Zzk)
480Ω
(Zzt)
60Ω
Electronic Component
BM0227559971
Diode
1
Current(Ir)
2uA
Power Dissipation(Pd)
350mW
Electronic Component
4.8V~5.4V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C5V1 — 5.1V 稳压二极管 产品概述

一、主要参数与封装

BZT52C5V1 是一款独立式(分立)稳压二极管(Zener),品牌为 Hottech(合科泰),封装为 SOD-123 表面贴装小封装。主要电气参数如下:

  • 标称稳压值:5.1V(典型值)
  • 稳压值范围:4.8V ~ 5.4V(对应约 ±5.9% 容差)
  • 反向泄漏电流 Ir:2 μA(给定条件下,如 VR=2V 时测得)
  • 耗散功率 Pd:350 mW(器件最大耗散,受环境温度和PCB散热影响)
  • 动态阻抗 Zzt:60 Ω(测试电流处的阻抗,影响稳压精度)
  • 膝部阻抗 Zzk:480 Ω(表示低电流区“软”膝部特性)

二、电气特性解读

  • 稳压值与容差:标称 5.1V,实测范围 4.8–5.4V,适合对精度要求不高的参考或小电流局部稳压场合。
  • 泄漏电流:2 μA 的低泄漏利于在高阻电路或待机电流要求低的系统中使用,但随温度升高会增加(需注意高温下的偏移)。
  • 动态阻抗与稳压性能:Zzt=60 Ω 表明在测试电流下仍有一定的电压随电流变化而波动,若要求较好稳压需在合适的电流点工作或用低阻抗并联滤波。Zzk=480 Ω 指示在极低电流时膝部较“软”,低电流下稳压特性不理想。

计算提示:若在理想散热条件下允许器件承受 Pd=350 mW,则最大持续通过的稳压电流约为 Iz_max ≈ 350mW / 5.1V ≈ 68.6 mA。但实际应用中应做热降额与寿命考虑,通常不建议长期在此极限电流下工作。

三、典型应用场景

  • 小电流参考电压源:为低功耗电路或传感器提供 5.1V 参考(当负载和偏置电流较小时)。
  • 输入/信号保护:用于对输入或信号线过电压夹位、吸收尖峰。
  • 简单的局部稳压:与串联电阻配合,为小型模块提供简单稳压(适用于几毫安至几十毫安场景,注意热管理)。
  • 电路样机与成本敏感设计:SOD-123 小封装、成本低,适合批量生产与空间受限板面。

四、设计与使用注意事项

  • 工作电流选择:为了换取更稳定的稳压性能,建议在 mA 级别(例如 1–10 mA)范围内选定工作点;若需要更好精度或更大电流,应选择功率更高或精度更好的稳压元件。
  • 热管理:器件耗散功率受PCB铜箔面积和环境温度影响,长时间高电流运行需考虑散热与降额。
  • 漏电与温漂:在待机或高精度测量电路,需考虑 Ir 随温度上升导致的偏移,必要时增加温度补偿或选用更低漏电的替代器件。
  • 并联电容:并联一个小容量电容可降低瞬态噪声和抑制振荡,改善稳压动态响应。

五、封装与焊接建议

SOD-123 为小型表贴封装,适合回流焊工艺。为保证长期可靠性,建议按厂家(Hottech)数据手册提供的回流温度曲线与焊接建议进行操作,并在PCB设计时预留合理的焊盘面积以改善散热。

六、选型与替代建议

BZT52 系列型号众多,若需更精确或更大功率,可考虑同系列中标称电压相近但功耗更高或动态阻抗更低的型号;若对泄漏电流、温漂有更高要求,可选择低漏型或精密稳压源(如基准二极管或线性稳压器)。订购与替换时,请以完整型号(BZT52C5V1)、封装(SOD-123)与供应商(Hottech / 合科泰)为准,并参阅最新数据手册确认所有测试条件。

备注:上述参数与计算以产品给定的关键指标为基础,具体设计应以 Hottech 官方 datasheet 与实际测量为准。

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