Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Hottech HKTG90N03
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech HKTG90N03
- Type
- HOTTECH
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- HKTG90N03
- Electronic Component
- 1
- Package
- PDFN(5x6)
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.17g
- Electronic Component
- 1
- Electronic Component
- BM0228550680
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 90W
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage(Vdss)
- 30V
- Capacitor(Ciss)
- 2nF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HKTG90N03 产品概述
一、主要参数概览
HKTG90N03 为 Hottech（合科泰）出品的单个 N 沟道功率 MOSFET，适用于中低压大电流开关场合。主要参数如下：
- 漏源电压 Vdss：30 V
- 连续漏极电流 Id：90 A
- 导通电阻 RDS(on)：3.8 mΩ @ Vgs=10 V、Id=20 A（典型/标称）
- 耗散功率 Pd：90 W（封装限制相关）
- 阈值电压 Vgs(th)：1.6 V（典型）
- 输入电容 Ciss：2 nF @ 15 V
- 反向传输电容 Crss：240 pF @ 15 V
- 工作温度范围：-55 ℃ ～ +150 ℃
- 封装：PDFN (5×6)，单片 N 沟道
二、产品特点
- 低导通电阻：3.8 mΩ 的低 RDS(on) 在中等栅压下提供出色的导通损耗控制，适合高效率功率传输。
- 大电流能力：标称 90 A 连续电流，适合要求高瞬态和稳态电流的场合（需配合良好散热）。
- 低栅容：Ciss 仅 2 nF，有利于快速开关、降低驱动能量和 EMI 管理；Crss 240 pF 有助于减小米勒效应。
- 宽温度范围与高功率耗散能力，适应工业级环境。
三、典型应用
- 同步整流 / DC-DC 降压转换器（高效率前端与输出级）
- 电机驱动 H 桥或半桥功率开关
- 电池管理与高电流负载开关
- 开关电源、汽车电子（30 V 级别）及工业电源模块
四、驱动与开关建议
- 推荐栅极驱动电压 10 V 以达到规格内的低 RDS(on)。Vgs(th)=1.6 V 表明器件非严格逻辑电平型，若使用 5 V 驱动需评估导通损耗。
- 根据 Ciss 估算，Qg 约为 Ciss×Vgs ≈ 2 nF × 10 V ≈ 20 nC（近似），驱动器需能提供相应充放电电流以保证开关速度。
- 设计时注意米勒区对开关过渡的影响，必要时加入栅极阻抗或缓冲网络以控制 dv/dt 和振铃。
五、封装与热管理
PDFN (5×6) 提供较小占板面积与暴露底板散热路径，充分利用底部大散热焊盘和过孔进行热扩散是实现高 Pd 的关键。推荐：
- 在 PCB 底板做多个热过孔并与散热层连接；
- 在高功率应用中进行热仿真并保证结-环境热阻满足要求；
- 在连续大电流工况下，按温升控制电流以避免超温降额。
六、可靠性与使用注意
- 器件参数多为典型或标称值，实际使用中需参考完整数据手册和 SOA 限制；
- 对于高频切换或反复热循环应用，注意 PCB 焊盘应符合热循环可靠性设计；
- 在没有钳位或缓冲的环境下，注意防止过压、反向二极管应力及可能的雪崩能量。
总结：HKTG90N03 在 30 V 级别提供低 RDS(on) 与高电流能力，适合追求高效率和紧凑封装的电源与电机驱动设计，但实现其标称性能依赖于合理的栅极驱动与 PCB 热管理。若需进一步电气特性曲线或封装详图建议索取完整器件数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
