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Hottech 1N4448W
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech 1N4448W
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- 1N4448W
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Switch Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0265642377
- Current
- 500mA
- Diode
- 1
- Current(Ir)
- 2.5uA
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1N4448W 产品概述
一、主要参数
- 器件类型：开关二极管（小信号开关/整流）
- 型号/品牌：1N4448W / Hottech（合科泰）
- 封装：SOD-123
- 正向压降：Vf = 1.25 V @ 150 mA
- 直流反向耐压：Vr = 75 V
- 最大整流电流：If = 500 mA（直流）
- 耗散功率：Pd = 500 mW
- 反向电流：Ir = 2.5 μA
- 反向恢复时间：Trr = 4 ns
- 非重复峰值浪涌电流：Ifsm = 2 A
二、器件特性与优势
1N4448W 属于高速开关二极管，具有较低的反向恢复时间（4 ns），适合高频开关场合。75 V 的反向耐压保证了在较高电压环境下的可靠性；在中等电流（≤500 mA）下工作稳定，SOD-123 小封装便于表面贴装，适合体积受限的应用。低反向电流（2.5 μA）有利于减少漏电损耗，提高静态性能。
三、电气与热设计要点
- 正向压降随电流上升而增加，150 mA 时约 1.25 V，功耗随负载显著上升，需注意 Pd=500 mW 的限制，长时间高电流工作需借助 PCB 散热设计。
- 封装热阻较大，建议在 PCB 设计上增大焊盘面积并加装散热铜箔或过孔，缩短引线路径以降低寄生电感。
- 在高频开关应用中，短走线与小回路面积可降低振铃与电磁干扰。
四、典型应用场景
- 高频开关电路与快速整流
- 开关电源的夹位、回收二极管与抽头整流
- 数字逻辑电路中的快速切换、采样保持电路
- 通信设备、消费电子中做保护或小信号整流使用
五、封装与可靠性
SOD-123 封装利于自动贴装与流焊工艺，外观端面标识阴极。Hottech（合科泰）在量产中应通过焊接耐热性、温升测试及高低温循环验证，以确保长期可靠性。注意潮湿敏感度等级（MSL）与贴片回流曲线匹配，开封后按厂商推荐回流工艺处理。
六、选型建议
若电路需在高频、低漏电与中等电流下可靠工作，1N4448W 为合适选择。设计时优先确认最大结温和器件耗散是否满足实际负载；若需更高电流或更低正向压降，应考虑更大功率封装或肖特基型二极管作为替代。购买时留意品牌、批次与出厂测试资料，必要时索取样片进行电路验证。
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