WMSIC Electronic Components

Hottech HKTQ80N03

ModelHKTQ80N03
PackagePDFN3333-8
BrandHottech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Hottech HKTQ80N03
Type
HOTTECH
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOTTECH
Electronic Component
HKTQ80N03
Electronic Component
1
Package
PDFN3333-8
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.095g
Electronic Component
1
Electronic Component
BM0264463950
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
37W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
30V
Capacitor(Ciss)
1.92nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HKTQ80N03 产品概述

一、产品简介

HKTQ80N03 是合科泰(Hottech)推出的一款高性能 N 沟道功率 MOSFET,封装为 PDFN3333-8。该器件额定漏源电压 30V,适用于中低压高电流开关场合,单片连续漏极电流高达 80A,结合极低的导通电阻与适中的栅极电荷,能在开关电源、同步整流与电机驱动等应用中实现高效率与良好热稳定性。

二、主要规格(典型参数)

  • 漏源击穿电压 Vdss:30V
  • 连续漏极电流 Id:80A
  • 导通电阻 RDS(on):5.2 mΩ @ Vgs = 10V
  • 耗散功率 Pd:37W(器件额定值,实际散热能力依 PCB 设计与散热条件)
  • 阈值电压 Vgs(th):2.5V(典型)
  • 总栅极电荷 Qg:38 nC @ Vgs = 10V
  • 输入电容 Ciss:1.92 nF
  • 反向传输电容 Crss:260 pF
  • 工作温度:-55 ℃ ~ +150 ℃
  • 封装:PDFN3333-8
  • 品牌:Hottech(合科泰)

三、性能亮点

  • 低导通阻抗:5.2 mΩ 在 Vgs=10V 条件下能显著降低导通损耗,适合大电流低压降场合。
  • 高电流承载:80A 连续电流能力,满足高效率 DC-DC、同步整流等应用的需求。
  • 适度栅电荷:Qg=38 nC 在保证快速开关的同时,对驱动器要求适中,便于设计驱动电路。
  • 宽温度范围:工作温度达 -55℃ 至 +150℃,适用于工业级应用。

四、封装与热管理

PDFN3333-8 小型化封装利于高密度布局,但热阻相对较高,建议在 PCB 设计时:

  • 在器件底部和焊盘处使用大面积铜箔并配合多盏过孔下通至散热层;
  • 保证热源与散热路径直接连通,必要时配合散热片或金属基板;
  • 注意器件功耗 Pd=37W 为标称值,实际允许耗散与板上散热条件密切相关。

五、典型应用场景

  • 同步降压转换器(Synchronous Buck)与开关电源开关管;
  • 电池管理与保护电路;
  • 电机驱动低侧/高侧开关(配合合适驱动器使用);
  • 车载电子、通信设备、工业控制等需要低导通损耗与高电流能力的场合。

六、设计与选型建议

  • 驱动电压:为获得最优 RDS(on),建议 Vgs 驱动至 10V;若使用 4.5V 驱动,应评估 RDS(on) 上升对系统损耗的影响。
  • 驱动能力:Qg=38 nC 对驱动器瞬时输出电流有一定要求,可在栅极串联适当阻值(10–47Ω)以抑制振铃与减小开关应力。
  • 开关过渡:考虑 Crss 导致的米勒效应,布局应尽量缩短栅—漏回路,减少寄生电感。
  • 保护措施:建议在易受冲击的应用中配合 TVS、RC 抑制网络或缓启动电路保护 MOSFET。

七、可靠性与使用注意事项

  • 避免长期在高结温下工作,建议按照应用工况评估结温并留裕量;
  • 焊接与回流工艺应遵循封装厂商推荐的温度曲线,防止机械与热应力损伤;
  • 在高 dV/dt 场合注意光耦或驱动器绝缘与共地布线,防止误触发或栅极注入电荷造成的不稳定。

如需更详细的电气特性曲线、热阻模型或封装引脚图,请提供具体设计条件或索取厂家完整数据手册,以便给出更精确的选型与布局建议。

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