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Hottech BZT52B5V1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech BZT52B5V1
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- BZT52B5V1
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- (Zzk)
- 480Ω
- (Zzt)
- 60Ω
- Electronic Component
- BM0264463974
- Diode
- 1
- Current(Ir)
- 2uA@2V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 5V~5.2V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52B5V1（5.1V）产品概述
一、产品简介
BZT52B5V1 是 Hottech（合科泰）出品的一枚表面贴装稳压二极管，单只独立式封装，采用平面芯片结构，封装形式为 SOD-123。该器件为中等电流、低功耗的齐纳（二极管）稳压元件，适用于精简电源稳压、参考电压和浪涌钳位等场合。
二、主要电气参数
- 标称稳压值：5.1V（典型）
- 稳压值范围：5.0V ~ 5.2V
- 反向漏电流 Ir：2 μA @ 2V
- 耗散功率 Pd：500 mW（最大）
- 阻抗 Zzt：60 Ω
- 阻抗 Zzk：480 Ω
- 二极管配置：1个独立式
以上参数反映了 BZT52B5V1 在低电流工作点下的稳压精度与漏电特性，以及在不同测试条件下的交流阻抗特性，适合对稳压精度和噪声有中等要求的应用。
三、特点与优势
- 中等电流能力，适合小型功率回路的稳压与保护；
- 500 mW 的功耗等级，在合理散热条件下可为小信号电路提供可靠稳压；
- 平面芯片结构，温度特性稳定且批量一致性好；
- SOD-123 小型表面贴装，便于高密度 PCB 设计与自动化贴装；
- 低反向电流，有利于低功耗系统和高阻抗输入电路的稳定工作。
四、典型应用
- 小电流稳压源与参考电压电路；
- 电源旁路、过压钳位与瞬态抑制；
- 信号调理与偏置电路；
- 便携设备、传感器模块和低功耗电子产品中的局部稳压。
五、使用与封装建议
- 封装为 SOD-123，适配常见 SMD 工艺与回流焊接设备；建议遵循印制板设计规则，靠近热源处增加铜面积以改善散热；
- 在接近 Pd 极限功耗时，应考虑器件至环境的热阻，必要时增大焊盘铜箔或加散热层以降低结温；
- 采用典型回流焊工艺安装，避免反复高温曝露导致封装应力；
- 若用于高精度参考，应对偏置电流、温漂和阻抗进行电路级校正。
六、选型与替代
BZT52B5V1 适合需要 5.1V 稳压、功耗不高且封装紧凑的场合。选型时请注意系统最大电流、允许结温以及稳压精度要求。对于功率或精度要求更高的场合，可考虑功率等级或精度等级更高的齐纳二极管。
如需样片或批量采购信息，请联系 Hottech（合科泰）授权经销渠道，确认最新器件型号、温度系数及出货封装形式。
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