Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Hottech BAV99
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech BAV99
- Type
- HOTTECH
- Minimum package
- 3000
Technical parameters
- Electronic Component
- HOTTECH
- Electronic Component
- BAV99
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0264685583
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2.5uA@70V
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 225mW
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 70V
- (Trr)
- 6ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：BAV99 开关二极管
1. 产品简介
BAV99 是一种高性能开关二极管，广泛应用于各种电子电路中，特别是在电源管理和信号处理等领域。它采用 SOT-23 封装，具有良好的散热性能和紧凑的设计，适合在空间受限的应用中使用。同时，BAV99 的反向恢复时间非常短，能够支持高速开关操作，提升电路整体性能。
2. 基本参数
- 二极管配置：BAV99 采用 1 对串联式设计，这使得它在应用中能够有效地应对较高的电压和电流要求。
- 反向恢复时间 (trr)：为 6ns，这一参数体现了其快速响应能力，适合用作高速开关二极管。
- 反向电流 (Ir)：在额定电压 70V 下，反向电流为 2.5µA，表明其具有较低的漏电流，能够提供更高的电路稳定性。
- 商品分类：该器件归属于开关二极管，特别适用于信号的整流和处理。
- 整流电流：最高整流电流可达 200mA，适合用于多数标准电力电子应用。
- 正向压降 (Vf)：在 150mA 的工作条件下，正向压降为 1.25V，大大降低了功耗，提升了效率。
- 直流反向耐压 (Vr)：支持高达 70V 的直流反向耐压，为其在多种电气环境下的应用提供了很大的灵活性。
3. 应用领域
BAV99 二极管因其优越的性能，能够在多种电子产品中发挥重要作用。以下是一些典型应用领域：
- 信号整流：广泛用于音频和视频信号整流电路，能够有效整流并过滤信号，保持信号质量。
- 电源管理：在开关电源和线性电源中，BAV99 可以用于保护电路和提升效率，确保稳定的电源输出。
- 高频开关电路：由于其短反向恢复时间，BAV99 适合用作高频开关电路中的关键元件。
- 保护电路：在过压保护和静电放电保护电路中，BAV99 可以有效避免电路受到损害，增加系统可靠性。
- 小信号处理：在各种小信号应用中，它能提供卓越的性能，支持精确的信号处理。
4. 性能优势
- 高效性：较低的正向压降和漏电流，使得 BAV99 在工作过程中更加高效，能够有效降低系统能耗。
- 快速响应：反向恢复时间短，能够快速切换，适应高频率的操作需求。
- 高可靠性：在电气隔离和反向电压条件下表现优秀，确保了设备长期稳定运行。
- 小尺寸：SOT-23 封装设计使其在狭小的环境中也能得到应用，并有效节省空间。
5. 结论
BAV99 是一种适用于多种领域的高性能开关二极管，结合了诸如低正向压降、短反向恢复时间和高耐压等多种优点。无论是在高频电路设计、信号整流、还是电源管理等应用中，BAV99 均能提供可靠的性能和效率。在现代电子设计中，其紧凑的封装和卓越的性能使其成为工程师们的重要选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
