WMSIC Electronic Components

HF(宏发) HFD3/12

ModelHFD3/12
PackageDIP,15x7.5mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HFD3 / 12
Type
HF
Minimum package
4000

Technical parameters

Electronic Component
HF
Electronic Component
HFD3/12
Electronic Component
1
Electronic Component
7.5mm
Package
DIP,15x7.5mm
Electronic Component
Signal Relay
Electronic Component
3.34g
Electronic Component
15mm
Electronic Component
8
Electronic Component
1
Electronic Component
4ms
Electronic Component
BM0228575199
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
12V
Coil Resistor
1.028kΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFD3/12 信号继电器 产品概述

一、产品简介

HFD3/12 是宏发(HF)推出的一款小型低功耗信号继电器,封装为 DIP 形式,外形尺寸仅 15 × 7.5 mm,8 引脚设计,触点形式为两组转换(2C,双刀双掷)。该器件针对信号切换与控制应用优化,具有低线圈功耗、快速响应和良好的接触可靠性,适合在通信、仪表、自动化控制与音视频等对体积与功耗敏感的场合中使用。

二、主要性能参数

  • 线圈电压:12 V
  • 额定线圈功率:140 mW
  • 线圈电阻:1.028 kΩ(线圈电流约 11.7 mA,P = V^2/R ≈ 0.14 W)
  • 触点形式:2C(双刀双掷)
  • 引脚数:8,DIP 封装
  • 触点容量(电阻负载):500 mA @ 125 VAC;3 A @ 30 VDC
  • 最大切换电压:277 V AC;220 V DC
  • 最大切换电流:4 A
  • 接触电阻:100 mΩ(典型)
  • 触点材料:AgNi + 镀金(提高低电平信号可靠性)
  • 动作/释放时间:4 ms / 4 ms
  • 线圈类型:有极性(单线圈)——接线时须注意极性
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装尺寸:15 mm × 7.5 mm,DIP

三、关键特性与优势

  • 低功耗:线圈额定功耗仅 140 mW,线圈电流约 11.7 mA,便于电池供电或大规模阵列应用,降低整体能耗与热量。
  • 紧凑体积:15×7.5 mm 的小型 DIP 封装,节省 PCB 面积,适合高密度布板。
  • 快速响应:典型动作与释放时间均为 4 ms,适合需要较快切换的信号路径与控制回路。
  • 良好信号保持:触点采用 AgNi 材料并有镀金处理,能保证在低电平微弱信号下的接触稳定性和抗氧化能力,适合音频、通信与测试设备中的低电平信号切换。
  • 多用途触点能力:虽为信号继电器,但触点最大支持 4 A 峰值电流及 3 A @ 30 VDC 的直流负载能力,扩展了使用场景(仍需按额定负载规则选用)。

四、推荐应用场景

  • 通信设备中的信号切换与环回切换
  • 仪器仪表、测试测量系统的通道切换
  • 音视频设备的输入输出选择与静音切换
  • 低功耗远程终端与传感节点的控制回路
  • 工业自动化中的控制信号切换与小电流负载控制

五、使用建议与注意事项

  • 极性注意:器件标注为“有极性-单线圈”,安装与驱动时必须严格按标识接线,避免反接损坏线圈或内部元件。
  • 抑制回路:在用晶体管或 MCU 驱动线圈时建议加入电感回路抑制(飞弧二极管、TVS 或 RC 抑制器),以降低反向浪涌对驱动器件的影响。若使用二极管吸收,请注意二极管的压降可能影响线圈的动作保持电压。
  • 负载选择:触点在直流高压时(如 30 VDC)有较高电流能力(3 A),但在高交流电压下额定为 500 mA @125 VAC。实际应用时应依据被切换回路的电压、电流性质(感性/容性/电阻性)以及开关次数来评估适配性。
  • 焊接与安装:DIP 封装适用于通孔插件工艺,推荐按照制造商的焊接温度曲线和 PCB 布局指南进行,以保证可靠焊接与良好散热。
  • 环境与寿命:工作温度范围宽(-40 ~ +85 ℃),适合大部分室内外环境。长期寿命受切换负载、频率与环境污染影响,低电平信号建议使用镀金触点版本以延长可靠工作寿命。

六、封装与订购信息

  • 品牌:HF(宏发)
  • 型号:HFD3/12
  • 封装:DIP,8 引脚,尺寸 15 × 7.5 mm
  • 典型应用:信号继电器、低功耗切换模块、通讯/测试设备

如需进一步的技术参数表(如典型寿命曲线、绝缘电阻、介质强度、引脚排列图)或 PCB 封装库文件,请提供您具体的设计要求或联系供应商以获取完整规格书与包装信息。

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